Datasheets
TDA8034HN/C1,151 by: NXP Semiconductors

TDA8034HN - Low power smart card interface QFN 24-Pin

Part Details for TDA8034HN/C1,151 by NXP Semiconductors

Results Overview of TDA8034HN/C1,151 by NXP Semiconductors

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Price & Stock for TDA8034HN/C1,151

Part # Distributor Description Stock Price Buy
DISTI # 72R6510
Newark Smart Card Interface, Analog, Hvqfn-24, Ic Interface Type:Analog, Interface Applications:Electronic Payments, Identification, Bank Card Readers, Pay Tv, Supply Voltage Min:4.75V, Supply Voltage Max:5.25V, Interface Case Style:Hvqfn Rohs Compliant: Yes |Nxp TDA8034HN/C1,151 RoHS: Compliant Min Qty: 490 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 100 $0.9050
  • 500 $0.8000
  • 1,000 $0.6990
  • 2,500 $0.5640
  • 10,000 $0.5470
$0.5470 / $0.9050 Buy Now
DISTI # 86038329
Verical Smart Card Interface 3.3V/5V 250mW Tray 24-Pin HVQFN EP RoHS: Compliant Min Qty: 421 Package Multiple: 1 Date Code: 2101 Americas - 3329
  • 421 $0.8908
  • 500 $0.8016
  • 1,000 $0.7394
  • 10,000 $0.6591
  • 100,000 $0.5523
$0.5523 / $0.8908 Buy Now
Rochester Electronics IC SMARD CARD INTERFACE 24HVQFN RoHS: Compliant Status: Obsolete Min Qty: 1 3329
  • 100 $0.7126
  • 500 $0.6413
  • 1,000 $0.5915
  • 10,000 $0.5273
  • 100,000 $0.4418
$0.4418 / $0.7126 Buy Now

Part Details for TDA8034HN/C1,151

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TDA8034HN/C1,151 Part Data Attributes

TDA8034HN/C1,151 NXP Semiconductors
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TDA8034HN/C1,151 NXP Semiconductors TDA8034HN - Low power smart card interface QFN 24-Pin
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN
Package Description 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, SOT616-1, MO-220, SOT616-1 HVQFN-24
Pin Count 24
Manufacturer Package Code SOT616-1
Reach Compliance Code compliant
Samacsys Manufacturer NXP
Additional Feature IT ALSO REQURIES A 4.85V TO 5.5V SUPPLY
Consumer IC Type CONSUMER CIRCUIT
JESD-30 Code S-PQCC-N24
Length 4 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 24
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Surface Mount YES
Temperature Grade OTHER
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4 mm

Alternate Parts for TDA8034HN/C1,151

This table gives cross-reference parts and alternative options found for TDA8034HN/C1,151. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TDA8034HN/C1,151, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TDA8034HN/C1,118 NXP Semiconductors $0.7327 TDA8034HN - Low power smart card interface QFN 24-Pin TDA8034HN/C1,151 vs TDA8034HN/C1,118
TDA8034HN/C2 NXP Semiconductors Check for Price SPECIALTY CONSUMER CIRCUIT TDA8034HN/C1,151 vs TDA8034HN/C2
TDA8034HN NXP Semiconductors Check for Price IC SPECIALTY CONSUMER CIRCUIT, PQCC24, 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, SOT616-1, MO-220, SOT616-1 HVQFN-24, Consumer IC:Other TDA8034HN/C1,151 vs TDA8034HN
TDA8034HN/C1,157 NXP Semiconductors Check for Price TDA8034HN - Low power smart card interface QFN 24-Pin TDA8034HN/C1,151 vs TDA8034HN/C1,157

TDA8034HN/C1,151 Frequently Asked Questions (FAQ)

  • A good PCB layout for the TDA8034HN/C1,151 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.

  • To ensure EMC with the TDA8034HN/C1,151, follow proper PCB design guidelines, use shielding, and implement filtering on the input and output lines. Additionally, ensure that the device is properly grounded and that the system is designed to meet the relevant EMC standards.

  • The TDA8034HN/C1,151 has a thermal pad that must be connected to a heat sink or a thermal via to ensure proper heat dissipation. The device can operate up to 150°C, but it's recommended to keep the junction temperature below 125°C for optimal performance and reliability.

  • Yes, the TDA8034HN/C1,151 is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.

  • To troubleshoot issues with the TDA8034HN/C1,151, start by checking the power supply voltage, input and output signals, and the PCB layout. Use oscilloscopes and logic analyzers to debug the device's behavior. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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