Part Details for SSM3K15F(TE85L,F) by Toshiba America Electronic Components
Results Overview of SSM3K15F(TE85L,F) by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
SSM3K15F(TE85L,F) Information
SSM3K15F(TE85L,F) by Toshiba America Electronic Components is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for SSM3K15F(TE85L,F)
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
SSM3K15F(TE85L,F)
|
EBV Elektronik | Trans MOSFET NCH 30V 01A 3Pin SMini TR (Alt: SSM3K15F(TE85L,F)) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 27 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for SSM3K15F(TE85L,F)
SSM3K15F(TE85L,F) CAD Models
SSM3K15F(TE85L,F) Part Data Attributes
|
|
SSM3K15F(TE85L,F)
Toshiba America Electronic Components
Buy Now
Datasheet
|
Compare Parts:
SSM3K15F(TE85L,F)
Toshiba America Electronic Components
Trans MOSFET N-CH 30V 0.1A 3-Pin S-Mini T/R
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 |
SSM3K15F(TE85L,F) Frequently Asked Questions (FAQ)
-
Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
-
Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature and adjust the operating conditions accordingly.
-
The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
-
Yes, the SSM3K15F is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly snubbed and the PCB layout is optimized for high-frequency operation.
-
Handle the device with ESD-protective equipment and follow proper ESD-handling procedures. Use ESD-protective packaging and storage materials. Ensure that the device is properly grounded during assembly and testing.