Part Details for SPP15P10PGHKSA1 by Infineon Technologies AG
Results Overview of SPP15P10PGHKSA1 by Infineon Technologies AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
SPP15P10PGHKSA1 Information
SPP15P10PGHKSA1 by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for SPP15P10PGHKSA1
SPP15P10PGHKSA1 CAD Models
SPP15P10PGHKSA1 Part Data Attributes
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SPP15P10PGHKSA1
Infineon Technologies AG
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Datasheet
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SPP15P10PGHKSA1
Infineon Technologies AG
Power Field-Effect Transistor, 15A I(D), 100V, 0.24ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, GREEN, PLASTIC, TO-220, 3 PIN
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | GREEN, PLASTIC, TO-220, 3 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Additional Feature | AVALANCHE RATED | |
| Avalanche Energy Rating (Eas) | 230 mJ | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 100 V | |
| Drain Current-Max (ID) | 15 A | |
| Drain-source On Resistance-Max | 0.24 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JEDEC-95 Code | TO-220AB | |
| JESD-30 Code | R-PSFM-T3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Mode | ENHANCEMENT MODE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | P-CHANNEL | |
| Pulsed Drain Current-Max (IDM) | 60 A | |
| Surface Mount | NO | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | SINGLE | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
Alternate Parts for SPP15P10PGHKSA1
This table gives cross-reference parts and alternative options found for SPP15P10PGHKSA1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SPP15P10PGHKSA1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| SPP15P10PHXK | Infineon Technologies AG | Check for Price | Power Field-Effect Transistor, 15A I(D), 100V, 0.24ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, GREEN, PLASTIC, TO-220, 3 PIN | SPP15P10PGHKSA1 vs SPP15P10PHXK |
| SPP15P10PHXKSA1 | Infineon Technologies AG | Check for Price | Power Field-Effect Transistor, 15A I(D), 100V, 0.24ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, GREEN, PLASTIC, TO-220, 3 PIN | SPP15P10PGHKSA1 vs SPP15P10PHXKSA1 |
SPP15P10PGHKSA1 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and spacing to ensure optimal heat dissipation.
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Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the IGBT's gate-emitter voltage. The driver should also have a suitable propagation delay and rise/fall time to ensure proper switching.
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The SPP15P10PGHKSA1 has an internal overcurrent protection (OCP) feature that trips at 15A. However, it's recommended to implement an external OCP circuit to ensure reliable protection. The datasheet provides guidelines for designing an external OCP circuit.
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Infineon recommends using a heat sink with a thermal resistance of ≤ 0.5 K/W and ensuring good thermal contact between the module and heat sink. Additionally, a thermal interface material (TIM) with a thermal conductivity of ≥ 1 W/mK should be used.
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The SPP15P10PGHKSA1 should be stored in a dry, cool place with a temperature range of -40°C to +125°C and humidity < 60%. Handling should be done with electrostatic discharge (ESD) protection measures in place, such as wrist straps or ESD-safe workbenches.