Part Details for SMS230 by Diotec Semiconductor AG
Results Overview of SMS230 by Diotec Semiconductor AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
SMS230 Information
SMS230 by Diotec Semiconductor AG is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for SMS230
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
4878-SMS230-ND
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DigiKey | DIODE SCHOTTKY 30V 2A DO213AB Min Qty: 5000 Lead time: 8 Weeks Container: Bulk | Temporarily Out of Stock |
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$0.1812 | Buy Now |
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DISTI #
637-SMS230
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Mouser Electronics | Schottky Diodes & Rectifiers Schottky, Melf, 30V, 2A RoHS: Compliant | 4319 |
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$0.0750 / $0.4600 | Buy Now |
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Onlinecomponents.com | Schottky Diode - Melf - 30V - 2A RoHS: Compliant | 0 |
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$0.0491 / $0.0614 | Buy Now |
Part Details for SMS230
SMS230 CAD Models
SMS230 Part Data Attributes
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SMS230
Diotec Semiconductor AG
Buy Now
Datasheet
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SMS230
Diotec Semiconductor AG
Rectifier Diode, Schottky, 1 Phase, 1 Element, 2A, 30V V(RRM), Silicon, DO-213AB, ROHS COMPLIANT, PLASTIC, MELF-2
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | DIOTEC SEMICONDUCTOR AG | |
| Part Package Code | DO-213AB | |
| Package Description | ROHS COMPLIANT, PLASTIC, MELF-2 | |
| Pin Count | 2 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Application | GENERAL PURPOSE | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 0.5 V | |
| JEDEC-95 Code | DO-213AB | |
| JESD-30 Code | O-PELF-R2 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 55 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -50 °C | |
| Output Current-Max | 2 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | ROUND | |
| Package Style | LONG FORM | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Rep Pk Reverse Voltage-Max | 30 V | |
| Surface Mount | YES | |
| Technology | SCHOTTKY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | WRAP AROUND | |
| Terminal Position | END |
SMS230 Frequently Asked Questions (FAQ)
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A recommended PCB layout for optimal thermal performance would be to use a large copper area on the bottom side of the PCB as a heat sink, connected to the thermal pad of the SMS230. Additionally, using thermal vias to connect the top and bottom copper layers can help to dissipate heat more efficiently.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and consider the thermal resistance of the package (RθJA). Proper heat sinking, airflow, and thermal management are crucial to prevent overheating and ensure reliable operation.
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The recommended soldering conditions for the SMS230 are: peak temperature 260°C, time above 217°C 30s, and time above 240°C 10s. It's essential to follow these conditions to prevent damage to the device during the soldering process.
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When designing a PCB for the SMS230, it's crucial to consider the high current capability of the device. This includes using wide traces, thick copper layers, and ensuring that the PCB can handle the high current density. Additionally, using multiple vias to connect the top and bottom copper layers can help to reduce the current density and prevent hotspots.
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The SMS230 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and ensuring that the PCB is designed with ESD protection in mind.