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SE98A - DDR memory module temp sensor, 1.7 V to 3.6 V
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SE98ATP,547 by NXP Semiconductors is an Other Sensor/Transducer.
Other Sensors/Transducers are under the broader part category of Sensors/Transducers.
Sensors and transducers detect and measure physical quantities like temperature, pressure, and force, converting them into electrical signals for various applications. Read more about Sensors/Transducers on our Sensors/Transducers part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
61AC1896
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Newark | Temp Sensor, Open Drain, -40 To 125Deg C, Sensor Output Type:Digital, Accuracy:± 1°C, Sensor Case/Package:Hwson, No. Of Pins:8Pins, Supply Voltage Min:1.7V, Supply Voltage Max:3.6V, No. Of Channels:-, Resolution:11 Bits Rohs Compliant: Yes |Nxp SE98ATP,547 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 8413 |
|
$0.9900 / $1.2400 | Buy Now |
DISTI #
99R3026
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Newark | Ddr Memory Module Temp Sensor, 1.7 V To 3.6 V/ Reel Rohs Compliant: Yes |Nxp SE98ATP,547 RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
$0.7250 / $0.9160 | Buy Now |
DISTI #
568-4731-1-ND
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DigiKey | IC TEMP SENSOR DDR 8-HWSON Min Qty: 1 Lead time: 16 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
36612 In Stock |
|
$0.7625 / $1.5600 | Buy Now |
DISTI #
SE98ATP,547
|
Avnet Americas | Temp Sensor Digital Serial (2-Wire, I2C) 8-Pin HWSON EP T/R - Tape and Reel (Alt: SE98ATP,547) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
|
$0.6606 / $0.7765 | Buy Now |
DISTI #
771-SE98ATP547
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Mouser Electronics | Board Mount Temperature Sensors PROG TWI DIG 3.6V RoHS: Compliant | 4053 |
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$0.9010 / $1.5600 | Buy Now |
DISTI #
V72:2272_06544221
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Arrow Electronics | Temp Sensor Digital Serial (2-Wire, I2C, SMBus) 8-Pin HWSON EP T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks Date Code: 2331 Container: Cut Strips | Americas - 650 |
|
$0.7822 / $1.0442 | Buy Now |
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Quest Components | SENSOR/TRANSDUCER, 8 PIN, PLASTIC/EPOXY | 1744 |
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$1.2930 / $3.4480 | Buy Now |
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Quest Components | SENSOR/TRANSDUCER, 8 PIN, PLASTIC/EPOXY | 939 |
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$0.7130 / $1.5500 | Buy Now |
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NXP Semiconductors | ±1 °C accuracy temperature sensor with 400 kHz I2C interface in HWSON8 package, Reel 7" Q2/T3 in Drypack RoHS: Compliant pbFree: Yes Lead time: 16 Weeks, 0 Days Container: Reel | 3940 |
|
$0.8200 | Buy Now |
DISTI #
SE98ATP,547
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Avnet Silica | Temp Sensor Digital Serial 2Wire I2C 8Pin HWSON EP TR (Alt: SE98ATP,547) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now |
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SE98ATP,547
NXP Semiconductors
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Datasheet
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SE98ATP,547
NXP Semiconductors
SE98A - DDR memory module temp sensor, 1.7 V to 3.6 V
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Pin Count | 8 | |
Manufacturer Package Code | SOT1069-1 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | NXP | |
JESD-609 Code | e4 | |
Mounting Feature | SURFACE MOUNT | |
Number of Terminals | 8 | |
Operating Current-Max | 0.4 mA | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Equivalence Code | SOLCC8,.12,20 | |
Package Shape/Style | RECTANGULAR | |
Surface Mount | YES | |
Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
NXP recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Ensure the device is operated within the specified temperature range (-40°C to 150°C).
NXP recommends a peak reflow temperature of 260°C, with a soldering time of 30-60 seconds. Use a solder with a melting point above 217°C to prevent thermal damage.
Check the input voltage, output voltage, and current consumption. Verify the voltage regulator is properly bypassed and decoupled. Consult the datasheet and application notes for specific troubleshooting guidelines.
The device has built-in ESD protection diodes. However, it's essential to follow proper ESD handling procedures during assembly and testing. Implement latch-up prevention measures, such as using a latch-up immune process and following NXP's guidelines.