Part Details for SC511658MZP40 by NXP Semiconductors
Results Overview of SC511658MZP40 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
SC511658MZP40 Information
SC511658MZP40 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for SC511658MZP40
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | MPC555 - NXP 32-bit MCU, Power Arch , 448KB Flash, 40MHz, -40/+125degC, Automotive Qualified, PBGA 272 RoHS: Not Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 4 |
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$93.6900 / $117.1100 | Buy Now |
Part Details for SC511658MZP40
SC511658MZP40 CAD Models
SC511658MZP40 Part Data Attributes
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SC511658MZP40
NXP Semiconductors
Buy Now
Datasheet
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SC511658MZP40
NXP Semiconductors
32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PBGA272
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Has ADC | NO | |
| Additional Feature | ALSO REQUIRES 5V SUPPLY | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B272 | |
| JESD-609 Code | e0 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 101 | |
| Number of Terminals | 272 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | Not Qualified | |
| ROM (words) | 458752 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 2.65 mm | |
| Speed | 40 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | HCMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
SC511658MZP40 Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout and thermal management guide in their application note AN11524, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal performance and thermal dissipation.
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The SC511658MZP40 has built-in overcurrent protection and fault detection features. Engineers can use the device's internal current sense amplifier and fault detection pins to implement overcurrent protection and fault detection. NXP's application note AN11525 provides more information on how to implement these features.
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The recommended settings for the internal regulators can be found in the device's datasheet and application notes. Engineers should follow the recommended settings for the voltage regulators, such as the output voltage, output current, and soft-start timing, to ensure stable operation and optimal performance.
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To optimize power consumption and efficiency, engineers can follow NXP's recommendations for power management, such as using the device's low-power modes, optimizing the clock frequency, and using the internal power gating features. Additionally, engineers can use NXP's power estimation tool to estimate the device's power consumption and identify areas for optimization.
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The thermal limitations and derating factors for the SC511658MZP40 can be found in the device's datasheet and thermal management application note AN11524. Engineers should follow the recommended thermal design guidelines and derating factors to ensure the device operates within its specified temperature range and to prevent thermal-related failures.