Part Details for RC28F256P33TFA by Micron Technology Inc
Results Overview of RC28F256P33TFA by Micron Technology Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
RC28F256P33TFA Information
RC28F256P33TFA by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for RC28F256P33TFA
RC28F256P33TFA CAD Models
RC28F256P33TFA Part Data Attributes
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RC28F256P33TFA
Micron Technology Inc
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Datasheet
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RC28F256P33TFA
Micron Technology Inc
Flash, 16MX16, 95ns, PBGA64, BGA-64
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | BGA-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 95 ns | |
| Additional Feature | ASYNCHRONOUS READ MODE | |
| Boot Block | TOP | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e0 | |
| Length | 13 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 4,255 | |
| Number of Terminals | 64 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 2.7 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Sector Size | 16K,64K | |
| Standby Current-Max | 0.00021 A | |
| Supply Current-Max | 0.031 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD SILVER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | NO | |
| Type | NOR TYPE | |
| Width | 10 mm |
RC28F256P33TFA Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the RC28F256P33TFA is -40°C to 85°C.
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The power-up sequence should start with a stable VCC supply, followed by a stable VPP supply. During power-down, the VPP supply should be turned off before the VCC supply. Refer to the datasheet for specific timing requirements.
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The recommended method for programming the RC28F256P33TFA is through the use of a programming adapter or a programming socket, following the programming specifications outlined in the datasheet.
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The HOLD# signal should be used to pause the current operation, and the OE# signal should be used to enable or disable the output drivers. Refer to the datasheet for specific timing requirements and signal interactions.
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The recommended decoupling capacitor values for the RC28F256P33TFA are 0.1 μF to 1 μF for VCC and VPP, with a maximum ESR of 1 ohm.