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Consumer IC,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
29AK3635
|
Newark | Mipi Lane Switch, -40 To 85Deg C |Diodes Inc. PI3WVR626XEBEX RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 0 |
|
$0.3830 / $1.4800 | Buy Now |
DISTI #
31-PI3WVR626XEBEXCT-ND
|
DigiKey | MIPI SWITCH,X1-QFN2525-24,T&R,3. Min Qty: 1 Lead time: 12 Weeks Container: Digi-Reel®, Tape & Reel (TR), Cut Tape (CT) |
3181 In Stock |
|
$0.3584 / $0.8300 | Buy Now |
DISTI #
PI3WVR626XEBEX
|
Avnet Americas | - Tape and Reel (Alt: PI3WVR626XEBEX) RoHS: Compliant Min Qty: 3500 Package Multiple: 3500 Lead time: 12 Weeks, 0 Days Container: Reel | 0 |
|
$0.3302 / $0.3371 | Buy Now |
DISTI #
621-PI3WVR626XEBEX
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Mouser Electronics | Video Switch ICs MIPI Switch X1-QFN2525-24 T&R 3.5K RoHS: Compliant | 3181 |
|
$0.3440 / $1.4800 | Buy Now |
DISTI #
PI3WVR626XEBEX
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IBS Electronics | 2: 1 MIPI 2-DATA LANE SWITCH 1.5V TO 3.6V 24-PIN X1QFN T/R Min Qty: 3500 Package Multiple: 1 | 3500 |
|
$0.4290 / $0.4420 | Buy Now |
DISTI #
SMC-PI3WVR626XEBEX
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 765 |
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RFQ | |
DISTI #
PI3WVR626XEBEX
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Avnet Silica | (Alt: PI3WVR626XEBEX) RoHS: Compliant Min Qty: 3500 Package Multiple: 3500 Lead time: 14 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
LCSC | 5 6 QFN-24-EP(2.5x2.5) Analog Switches Multiplexers ROHS | 25 |
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$1.0335 / $1.6898 | Buy Now |
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PI3WVR626XEBEX
Diodes Incorporated
Buy Now
Datasheet
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Compare Parts:
PI3WVR626XEBEX
Diodes Incorporated
Consumer IC,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | DIODES INC | |
Package Description | X1QFN-24 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 12 Weeks | |
Date Of Intro | 2020-03-05 | |
Samacsys Manufacturer | Diodes Incorporated | |
Consumer IC Type | CONSUMER CIRCUIT | |
JESD-30 Code | S-XQCC-N24 | |
Length | 2.5 mm | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC24,.1SQ,14 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Seated Height-Max | 0.5 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 1.5 V | |
Surface Mount | YES | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.35 mm | |
Terminal Position | QUAD | |
Width | 2.5 mm |
A good PCB layout for the PI3WVR626XEBEX involves keeping the input and output tracks as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
The PI3WVR626XEBEX has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to further protect the device from ESD events.
To troubleshoot issues with the PI3WVR626XEBEX, start by verifying the input voltage, output load, and PCB layout. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet for specific troubleshooting guidelines.
When using the PI3WVR626XEBEX in a high-reliability or safety-critical application, consider the device's failure modes, fault tolerance, and redundancy requirements. Ensure that the device is properly derated, and that the system design includes adequate fault detection and correction mechanisms.