Part Details for PBSS305NX,115 by NXP Semiconductors
Results Overview of PBSS305NX,115 by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
PBSS305NX,115 Information
PBSS305NX,115 by NXP Semiconductors is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for PBSS305NX,115
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 60 |
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RFQ | ||
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Quest Components | 4600 MA, 80 V, NPN, SI, SMALL SIGNAL TRANSISTOR | 48 |
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$0.3465 / $0.5775 | Buy Now |
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Vyrian | Transistors | 10683 |
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RFQ |
Part Details for PBSS305NX,115
PBSS305NX,115 CAD Models
PBSS305NX,115 Part Data Attributes
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PBSS305NX,115
NXP Semiconductors
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Datasheet
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PBSS305NX,115
NXP Semiconductors
PBSS305NX - 80 V, 4.6 A NPN low VCEsat (BISS) transistor SOT-89 3-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOT-89 | |
| Package Description | PLASTIC, SMD, SC-62, 3 PIN | |
| Pin Count | 3 | |
| Manufacturer Package Code | SOT89 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.21.00.75 | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 4.6 A | |
| Collector-Emitter Voltage-Max | 80 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 70 | |
| JESD-30 Code | R-PSSO-F3 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | NPN | |
| Power Dissipation-Max (Abs) | 2.1 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | TIN | |
| Terminal Form | FLAT | |
| Terminal Position | SINGLE | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| Transition Frequency-Nom (fT) | 110 MHz | |
| Turn-off Time-Max (toff) | 555 ns | |
| Turn-on Time-Max (ton) | 215 ns |
PBSS305NX,115 Frequently Asked Questions (FAQ)
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NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider derating the device's power dissipation and voltage ratings according to the operating temperature range.
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The PBSS305NX,115 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A human body model (HBM) of 2 kV and a machine model (MM) of 200 V are recommended for ESD protection.
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Yes, the PBSS305NX,115 is qualified according to AEC-Q101, making it suitable for automotive and high-reliability applications. However, it's essential to follow NXP's recommended qualification and testing procedures to ensure the device meets the specific application requirements.
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NXP recommends soldering the PBSS305NX,115 using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Hand soldering is not recommended due to the device's small size and high power density.