Part Details for OP07CS8#TRPBF by Analog Devices Inc
Results Overview of OP07CS8#TRPBF by Analog Devices Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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OP07CS8#TRPBF Information
OP07CS8#TRPBF by Analog Devices Inc is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for OP07CS8#TRPBF
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
OP07CS8#TRPBF-ND
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DigiKey | IC OPAMP GP 1 CIRCUIT 8SO Min Qty: 2500 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$3.7875 | Buy Now |
DISTI #
584-OP07CS8#TRPBF
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Mouser Electronics | Precision Amplifiers Prec Op Amp RoHS: Compliant | 0 |
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$3.7800 | Order Now |
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Analog Devices Inc | Prec Op Amp Min Qty: 2500 Package Multiple: 2500 | 0 |
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$3.0300 / $3.7875 | Buy Now |
DISTI #
OP07CS8#TRPBF
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Richardson RFPD | AMPLIFIER - OP AMPS RoHS: Compliant Min Qty: 2500 | 0 |
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$3.9200 / $4.0700 | Buy Now |
Part Details for OP07CS8#TRPBF
OP07CS8#TRPBF CAD Models
OP07CS8#TRPBF Part Data Attributes
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OP07CS8#TRPBF
Analog Devices Inc
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Datasheet
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OP07CS8#TRPBF
Analog Devices Inc
Precision Operational Amplifier
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Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Package Description | ROHS COMPLIANT, SOIC-8 | |
Pin Count | 8 | |
Manufacturer Package Code | 05-08-1610 (S8) | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Analog Devices | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Average Bias Current-Max (IIB) | 0.007 µA | |
Common-mode Reject Ratio-Nom | 100 dB | |
Input Offset Voltage-Max | 150 µV | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Neg Supply Voltage-Nom (Vsup) | -15 V | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Slew Rate-Nom | 0.25 V/us | |
Supply Voltage-Nom (Vsup) | 15 V | |
Surface Mount | YES | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Unity Gain BW-Nom | 600 |
OP07CS8#TRPBF Frequently Asked Questions (FAQ)
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A good PCB layout for the OP07CS8 involves keeping the input and output traces short and away from noise sources, using a ground plane, and decoupling the power supply pins with capacitors. A 4-layer PCB with a dedicated analog ground plane is recommended.
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To ensure stability, make sure to follow the recommended compensation capacitor values, use a low-ESR capacitor for decoupling, and avoid capacitive loads on the output. Also, check for oscillations by monitoring the output with a scope.
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The maximum power dissipation of the OP07CS8 is dependent on the package type and ambient temperature. For the SOIC-8 package, the maximum power dissipation is 670mW at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the operating temperature and package type.
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Yes, the OP07CS8 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is high enough to avoid loading the source, and the output impedance is low enough to drive the load. Also, consider the bandwidth and distortion requirements of your application.
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To protect the OP07CS8 from ESD damage, use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Also, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.