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Part Details for ONET1191VRGPT by Texas Instruments
Results Overview of ONET1191VRGPT by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ONET1191VRGPT Information
ONET1191VRGPT by Texas Instruments is an ATM/SONET/SDH IC.
ATM/SONET/SDH ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for ONET1191VRGPT
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86281363
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Verical | Laser Driver VCSEL 11.3Gbps 1-CH 20-Pin VQFN EP T/R RoHS: Compliant Min Qty: 44 Package Multiple: 1 Date Code: 1301 | Americas - 33977 |
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$6.9625 / $8.7000 | Buy Now |
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Rochester Electronics | ONET1191V 11.3-Gbps differential VCSEL driver RoHS: Compliant Status: Obsolete Min Qty: 1 | 33977 |
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$5.5700 / $6.9600 | Buy Now |
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LCSC | 11.3Gbps 2.9V3.6V 70mA QFN-20(4x4) Laser Drivers ROHS | 5 |
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$11.9186 / $12.3160 | Buy Now |
Part Details for ONET1191VRGPT
ONET1191VRGPT CAD Models
ONET1191VRGPT Part Data Attributes
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ONET1191VRGPT
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
ONET1191VRGPT
Texas Instruments
11.3-Gbps differential VCSEL driver 20-QFN -40 to 85
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | QFN | |
| Package Description | QFN-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A991.B.1 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Applications | SDH; SONET | |
| JESD-30 Code | S-PQCC-N20 | |
| JESD-609 Code | e4 | |
| Length | 4 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC20,.16SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Current-Max | 72 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4 mm |
ONET1191VRGPT Frequently Asked Questions (FAQ)
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Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, a thermal pad on the bottom of the package should be connected to the ground plane using multiple vias.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and PCB layout. Additionally, consider using a thermal monitoring system to detect overheating conditions.
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Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is 5.5V, which is higher than the recommended 3.3V or 5V supply voltage. However, exceeding this voltage may damage the device.
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To prevent electrostatic discharge (ESD) damage, it's recommended to use ESD protection devices, such as TVS diodes or ESD protection arrays, on the input and output pins. Additionally, follow proper handling and storage procedures to minimize the risk of ESD damage.
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To ensure proper operation, it's recommended to power up the device in the following sequence: VCC, then VIO, and finally the input signals. This sequence helps prevent latch-up and ensures reliable operation.