Part Details for OMAP3515DCBBA by Texas Instruments
Results Overview of OMAP3515DCBBA by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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OMAP3515DCBBA Information
OMAP3515DCBBA by Texas Instruments is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for OMAP3515DCBBA
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 334 |
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RFQ |
Part Details for OMAP3515DCBBA
OMAP3515DCBBA CAD Models
OMAP3515DCBBA Part Data Attributes
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OMAP3515DCBBA
Texas Instruments
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Datasheet
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OMAP3515DCBBA
Texas Instruments
Applications Processor 515-POP-FCBGA -40 to 105
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Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | VFBGA, BGA515,28X28,16 | |
Pin Count | 515 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PBGA-B515 | |
JESD-609 Code | e1 | |
Length | 12 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 515 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA515,28X28,16 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.9 mm | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | SoC |