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NT2H1311F0DTL - NFC Forum Type 2 Tag compliant IC with 144 bytes user memory and field detection SON 4-Pin
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
NT2H1311F0DTLH by NXP Semiconductors is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
54X5415
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Newark | Nfc Tag Reader, 13.56Mhz, Hxson-4, Frequency Min:-, Frequency Max:13.56Mhz, Rfid Ic Type:Reader, Programmable Memory:-, Output Power:-, Rf Ic Case Style:Hxson, No. Of Pins:4Pins, Supply Voltage Min:-, Supply Voltage Max:-, Current Rohs Compliant: Yes |Nxp NT2H1311F0DTLH RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Cut Tape | 4281 |
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$0.5630 / $0.8720 | Buy Now |
DISTI #
08X6731
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Newark | Nfc Forum Type 2 Tag Compliant Ic With 144 Bytes User Memory And Field Detection/ Reel Rohs Compliant: Yes |Nxp NT2H1311F0DTLH RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$0.3870 / $0.5030 | Buy Now |
DISTI #
568-12039-1-ND
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DigiKey | IC RFID TRANSP 13.56MHZ HXSON4 Min Qty: 1 Lead time: 16 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
6065 In Stock |
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$0.4847 / $0.8900 | Buy Now |
DISTI #
NT2H1311F0DTLH
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Avnet Americas | NFC Tag IC, 4 Pins, HXSON, ISO/IEC 14443-3 Type A, NFC Forum Type 2 Tag - Tape and Reel (Alt: NT2H1311F0DTLH) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$0.3471 / $0.4080 | Buy Now |
DISTI #
771-NT2H1311F0DTLH
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Mouser Electronics | NFC/RFID Tags & Transponders NFC Forum Type 2 Tag compliant IC RoHS: Compliant | 436 |
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$0.4290 / $0.8900 | Buy Now |
DISTI #
V72:2272_06531692
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Arrow Electronics | NFC/RFID Tag and Transponder IC 13560kHz 888Byte 4-Pin HXSON EP T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks Date Code: 2225 Container: Cut Strips | Americas - 2940 |
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$0.3905 / $0.4303 | Buy Now |
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Rochester Electronics | NFC Forum Type 2 Tag compliant IC with 144 bytes user memory and field detection RoHS: Compliant Status: Active Min Qty: 1 | 500 |
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$0.3205 / $0.5170 | Buy Now |
DISTI #
NT2H1311F0DTLH
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IBS Electronics | NFC FORUM TYPE 2 TAG COMPLIANT IC WITH 144 BYTES USER MEMORY AND FIELD DETECTION HXSON4 ROHS Min Qty: 4000 Package Multiple: 1 | 0 |
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$0.4680 / $0.4745 | Buy Now |
DISTI #
NT2H1311F0DTLH
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Avnet Silica | NFC Tag IC 4 Pins HXSON ISOIEC 144433 Type A NFC Forum Type 2 Tag (Alt: NT2H1311F0DTLH) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
NT2H1311F0DTLH
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EBV Elektronik | NFC Tag IC 4 Pins HXSON ISOIEC 144433 Type A NFC Forum Type 2 Tag (Alt: NT2H1311F0DTLH) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days | EBV - 4000 |
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Buy Now |
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NT2H1311F0DTLH
NXP Semiconductors
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Datasheet
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NT2H1311F0DTLH
NXP Semiconductors
NT2H1311F0DTL - NFC Forum Type 2 Tag compliant IC with 144 bytes user memory and field detection SON 4-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Pin Count | 4 | |
Manufacturer Package Code | SOT1312-1 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | NXP |
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor junction temperature (Tj) and ensure it stays within the recommended range (typically <150°C).
Implement ESD protection diodes (e.g., TVS or Zener diodes) on sensitive pins, and ensure a low-impedance path to ground. Use ESD-resistant components and follow proper handling and storage procedures.
Use a combination of high-frequency and low-frequency decoupling capacitors (e.g., 100nF and 10uF) placed close to the device. Ensure a low-inductance path to the power supply and use a solid ground plane.
Use controlled impedance traces, minimize signal routing, and avoid vias and stubs. Implement differential signaling, and consider using a signal integrity analysis tool to optimize your design.