Part Details for MSKD100-08 by Microsemi Corporation
Results Overview of MSKD100-08 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MSKD100-08 Information
MSKD100-08 by Microsemi Corporation is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for MSKD100-08
MSKD100-08 CAD Models
MSKD100-08 Part Data Attributes
|
MSKD100-08
Microsemi Corporation
Buy Now
Datasheet
|
Compare Parts:
MSKD100-08
Microsemi Corporation
Rectifier Diode, 1 Phase, 2 Element, 100A, 800V V(RRM), Silicon, CASE D1, 3 PIN
|
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | CASE D1, 3 PIN | |
Pin Count | 3 | |
Manufacturer Package Code | CASE D1 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Application | GENERAL PURPOSE | |
Case Connection | ISOLATED | |
Configuration | COMMON CATHODE, 2 ELEMENTS | |
Diode Element Material | SILICON | |
Diode Type | RECTIFIER DIODE | |
Forward Voltage-Max (VF) | 1.35 V | |
JESD-30 Code | R-XUFM-X3 | |
Non-rep Pk Forward Current-Max | 2500 A | |
Number of Elements | 2 | |
Number of Phases | 1 | |
Number of Terminals | 3 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -40 °C | |
Output Current-Max | 100 A | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Qualification Status | Not Qualified | |
Reference Standard | UL RECOGNIZED | |
Rep Pk Reverse Voltage-Max | 800 V | |
Surface Mount | NO | |
Terminal Form | UNSPECIFIED | |
Terminal Position | UPPER |
Alternate Parts for MSKD100-08
This table gives cross-reference parts and alternative options found for MSKD100-08. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MSKD100-08, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
MSKD100-18 | Microsemi Corporation | Check for Price | Rectifier Diode, 1 Phase, 2 Element, 100A, 1800V V(RRM), Silicon, CASE D1, 3 PIN | MSKD100-08 vs MSKD100-18 |
MSKD100-08 Frequently Asked Questions (FAQ)
-
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and crosstalk.
-
Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow around the device. Also, consider derating the output current and voltage according to the datasheet's thermal derating curve.
-
Use a shielded enclosure and ensure that the input and output cables are properly filtered and shielded. Also, consider adding EMI filters or common-mode chokes to the input and output lines.
-
Use an oscilloscope to monitor the input and output waveforms, and check for signs of oscillation or ringing. Also, verify that the input voltage and current are within the recommended specifications, and check for any signs of overheating or thermal shutdown.
-
Yes, but ensure that the devices are properly synchronized and that the output voltages are matched to within 1% to prevent current imbalance. Also, consider using a master-slave configuration to ensure that one device takes over in case of a failure.