Datasheets
MRFE6VP61K25HSR5 by:

RF POWER, FET

Part Details for MRFE6VP61K25HSR5 by NXP Semiconductors

Results Overview of MRFE6VP61K25HSR5 by NXP Semiconductors

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Applications Education and Research Industrial Automation Electronic Manufacturing Robotics and Drones

MRFE6VP61K25HSR5 Information

MRFE6VP61K25HSR5 by NXP Semiconductors is an RF Power Field-Effect Transistor.
RF Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for MRFE6VP61K25HSR5

Part # Distributor Description Stock Price Buy
DISTI # 19T6332
Newark Rf Power Fet, N Channel, 125V 1250W, Ni-1230S, Drain Source Voltage Vds:125V, Continuous Drain Current Id:100Ma, Power Dissipation:1.333Kw, Operating Frequency Min:1.8Mhz, Operating Frequency Max:600Mhz, No. Of Pins:4Pins, Msl:- Rohs Compliant: Yes |Nxp MRFE6VP61K25HSR5 RoHS: Compliant Min Qty: 50 Package Multiple: 1 Date Code: 0 Container: Cut Tape 0
  • 50 $197.4100
$197.4100 Buy Now
DISTI # 568-15043-1-ND
DigiKey RF MOSFET LDMOS 50V NI1230 Min Qty: 1 Lead time: 10 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 55
In Stock
  • 1 $262.4000
  • 10 $231.5670
  • 50 $210.5416
$210.5416 / $262.4000 Buy Now
DISTI # MRFE6VP61K25HSR5
Avnet Americas Transistor RF FET N-CH 133V 1.8MHz to 600MHz 4-Pin NI-1230S-4S T/R - Tape and Reel (Alt: MRFE6VP61K25HSR5) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 10 Weeks, 0 Days Container: Reel 0
  • 50 $193.4618
  • 100 $192.4748
  • 200 $191.4877
  • 300 $190.5007
  • 400 $189.5136
$189.5136 / $193.4618 Buy Now
DISTI # 841-MRFE6VP61K25HSR5
Mouser Electronics RF MOSFET Transistors VHV6 1.25KW ISM NI1230HS RoHS: Compliant 41
  • 1 $254.6300
  • 10 $221.5800
$221.5800 / $254.6300 Buy Now
DISTI # V36:1790_07204233
Arrow Electronics Trans RF MOSFET N-CH 133V 4-Pin Case 375E-04 T/R RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 10 Weeks Date Code: 2409 Americas - 1550
  • 50 $198.3900
$198.3900 Buy Now
DISTI # 83141723
Verical Trans RF MOSFET N-CH 133V 4-Pin Case 375E-04 T/R RoHS: Compliant Min Qty: 50 Package Multiple: 50 Date Code: 2409 Americas - 1550
  • 50 $198.3900
$198.3900 Buy Now
DISTI # 65096519
Verical Trans RF MOSFET N-CH 133V 4-Pin Case 375E-04 T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1902 Americas - 20
  • 1 $252.2500
$252.2500 Buy Now
DISTI # MRFE6VP61K25HS5
Richardson RFPD RF POWER TRANSISTOR RoHS: Compliant Min Qty: 1 20
  • 1 $230.4200
  • 10 $220.5400
  • 25 $214.4100
  • 50 $208.0600
$208.0600 / $230.4200 Buy Now
DISTI # MRFE6VP61K25HSR5
Avnet Silica Transistor RF FET NCH 133V 18MHz to 600MHz 4Pin NI1230S4S TR (Alt: MRFE6VP61K25HSR5) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 12 Weeks, 0 Days Silica - 0
Buy Now
Cytech Systems Limited RF MOSFET LDMOS 50V NI1230 50
RFQ
DISTI # MRFE6VP61K25HSR5
EBV Elektronik Transistor RF FET NCH 133V 18MHz to 600MHz 4Pin NI1230S4S TR (Alt: MRFE6VP61K25HSR5) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 12 Weeks, 0 Days EBV - 0
Buy Now

Part Details for MRFE6VP61K25HSR5

MRFE6VP61K25HSR5 CAD Models

MRFE6VP61K25HSR5 Part Data Attributes

MRFE6VP61K25HSR5 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
MRFE6VP61K25HSR5 NXP Semiconductors RF POWER, FET
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.29.00
Factory Lead Time 10 Weeks
Samacsys Manufacturer NXP
Case Connection SOURCE
Configuration SEPARATE, 2 ELEMENTS
DS Breakdown Voltage-Min 125 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
Number of Elements 2
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 225 °C
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 1300 W
Time@Peak Reflow Temperature-Max (s) 40

Alternate Parts for MRFE6VP61K25HSR5

This table gives cross-reference parts and alternative options found for MRFE6VP61K25HSR5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MRFE6VP61K25HSR5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MRFE6VP61K25HSR6 Freescale Semiconductor Check for Price 2 CHANNEL, UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, NI-1230S, CASE 375E-04, 4 PIN MRFE6VP61K25HSR5 vs MRFE6VP61K25HSR6
MRF6VP41KHSR6 NXP Semiconductors Check for Price RF POWER, FET MRFE6VP61K25HSR5 vs MRF6VP41KHSR6
MRF6VP41KHR5 NXP Semiconductors Check for Price RF POWER, FET MRFE6VP61K25HSR5 vs MRF6VP41KHR5

MRFE6VP61K25HSR5 Related Parts

MRFE6VP61K25HSR5 Frequently Asked Questions (FAQ)

  • The MRFE6VP61K25HSR5 can operate from -40°C to 150°C, but the recommended operating temperature range is -20°C to 120°C for optimal performance.

  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet. Typically, a voltage supply of 12-28V and a current of 100-500mA is recommended. Additionally, ensure the device is properly heat-sinked to prevent overheating.

  • The MRFE6VP61K25HSR5 can handle up to 25W of continuous power and up to 50W of peak power. However, it's essential to follow the recommended power handling guidelines outlined in the datasheet to prevent device damage.

  • To match the impedance of the MRFE6VP61K25HSR5 to your system, use a conjugate match technique. This involves designing an impedance matching network that presents a conjugate match to the device's output impedance. Consult the datasheet and application notes for more information.

  • For optimal performance and thermal management, follow these guidelines: use a multi-layer PCB with a solid ground plane, keep the device away from heat sources, use thermal vias to dissipate heat, and ensure good airflow around the device. Consult the datasheet and application notes for more detailed guidelines.

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