Part Details for MMFT960T1 by onsemi
Results Overview of MMFT960T1 by onsemi
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Audio and Video Systems
MMFT960T1 Information
MMFT960T1 by onsemi is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for MMFT960T1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 21 |
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RFQ | ||
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Component Electronics, Inc | IN STOCK SHIP TODAY | 1475 |
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$1.0000 / $1.5400 | Buy Now |
Part Details for MMFT960T1
MMFT960T1 CAD Models
MMFT960T1 Part Data Attributes
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MMFT960T1
onsemi
Buy Now
Datasheet
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Compare Parts:
MMFT960T1
onsemi
Small Signal MOSFET 60V 300mA 1.7 Ohm Single N-Channel SOT-223, SOT-223 (TO-261) 4 LEAD, 1000-REEL
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | SOT-223 (TO-261) 4 LEAD | |
| Package Description | CASE 318E-04, 4 PIN | |
| Pin Count | 4 | |
| Manufacturer Package Code | 0.0318 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | onsemi | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 60 V | |
| Drain Current-Max (ID) | 0.3 A | |
| Drain-source On Resistance-Max | 1.7 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JEDEC-95 Code | TO-261AA | |
| JESD-30 Code | R-PDSO-G4 | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 0.8 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
Alternate Parts for MMFT960T1
This table gives cross-reference parts and alternative options found for MMFT960T1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MMFT960T1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MMFT960T1 | Motorola Mobility LLC | Check for Price | 300mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA | MMFT960T1 vs MMFT960T1 |
MMFT960T1 Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
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Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
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The SOA is typically defined by the device's voltage, current, and power ratings. For the MMFT960T1, the SOA is typically limited by the maximum junction temperature (Tj) of 150°C, and the maximum power dissipation (Pd) of 1.5 W.
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Use proper ESD handling procedures, such as grounding straps, ESD mats, and ionizers. Also, ensure that the device is stored in an ESD-protective package, and handle the device by the body or pins, not the leads.
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A soldering profile with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds is recommended. Avoid exceeding the maximum soldering temperature of 260°C.