-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
General Purpose Inductor, 0.0043uH, 6.977%, 1 Element, Ceramic-Core, SMD, CHIP, 0201
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MLG0603P4N3ST000 by TDK Corporation is a Fixed Inductor.
Fixed Inductors are under the broader part category of Inductors.
Inductors are passive components that resist sudden changes in current by storing and releasing energy in an electromagnetic fiel. They are often used in power circuits and energy storage. Read more about Inductors on our Inductors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
31Y2700
|
Newark | Inductor, 4.3Nh, 5.8Ghz, 0201, Inductance:4.3Nh, Dc Resistance Max:0.4Ohm, Self Resonant Frequency:5.8Ghz, Dc Current Rating:350Ma, Inductor Case/Package:0201 [0603 Metric], Product Range:Mlg-P Series, Inductance Tolerance:± 0.3Nh Rohs Compliant: Yes |Tdk MLG0603P4N3ST000 RoHS: Compliant Min Qty: 10 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 0 |
|
$0.0170 / $0.0250 | Buy Now |
DISTI #
445-7817-1-ND
|
DigiKey | FIXED IND 4.3NH 350MA 400MOHM SM Min Qty: 1 Lead time: 12 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
26519 In Stock |
|
$0.0113 / $0.1000 | Buy Now |
DISTI #
MLG0603P4N3ST000
|
Avnet Americas | MLG0603P4N3ST000 - Tape and Reel (Alt: MLG0603P4N3ST000) RoHS: Compliant Min Qty: 15000 Package Multiple: 15000 Lead time: 12 Weeks, 0 Days Container: Reel | 0 |
|
$0.0134 / $0.0137 | Buy Now |
DISTI #
810-MLG0603P4N3ST000
|
Mouser Electronics | RF Inductors - SMD IND 0201 4.3nH Hi-Q SMD RF IND RoHS: Compliant | 12458 |
|
$0.0140 / $0.1000 | Buy Now |
DISTI #
MLG0603P4N3ST000
|
Avnet Abacus | MLG0603P4N3ST000 (Alt: MLG0603P4N3ST000) RoHS: Compliant Min Qty: 30000 Package Multiple: 15000 Lead time: 15 Weeks, 0 Days | Abacus - 0 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
MLG0603P4N3ST000
TDK Corporation
Buy Now
Datasheet
|
Compare Parts:
MLG0603P4N3ST000
TDK Corporation
General Purpose Inductor, 0.0043uH, 6.977%, 1 Element, Ceramic-Core, SMD, CHIP, 0201
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TDK CORP | |
Package Description | CHIP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8504.50.80.00 | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | TDK | |
Case/Size Code | 0201 | |
Construction | Rectangular | |
Core Material | CERAMIC | |
DC Resistance | 0.4 Ω | |
Inductance-Nom (L) | 0.0043 µH | |
Inductor Application | RF INDUCTOR | |
Inductor Type | GENERAL PURPOSE INDUCTOR | |
JESD-609 Code | e3 | |
Number of Functions | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Height | 0.3 mm | |
Package Length | 0.6 mm | |
Package Style | SMT | |
Package Width | 0.3 mm | |
Packing Method | TR, PUNCHED PAPER, 7 INCH | |
Quality Factor-Min (at L-nom) | 14 | |
Rated Current-Max | 0.35 A | |
Self Resonance Frequency | 5800 MHz | |
Shape/Size Description | RECTANGULAR PACKAGE | |
Shielded | NO | |
Surface Mount | YES | |
Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier | |
Terminal Placement | DUAL ENDED | |
Terminal Shape | WRAPAROUND | |
Test Frequency | 500 MHz | |
Tolerance | 6.98% |
This table gives cross-reference parts and alternative options found for MLG0603P4N3ST000. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MLG0603P4N3ST000, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
WLCM0603Z0S4N3TB | Walsin Technology Corporation | Check for Price | General Purpose Inductor, 0.0043uH, 6.9767%, 1 Element, Ceramic-Core, SMD, 0201, CHIP | MLG0603P4N3ST000 vs WLCM0603Z0S4N3TB |
LMCI0201-4N3ST | VENKEL LTD | Check for Price | General Purpose Inductor, | MLG0603P4N3ST000 vs LMCI0201-4N3ST |
CIH03U4N3SNC | Samsung Electro-Mechanics | Check for Price | General Purpose Inductor, 0.0043uH, 6.977%, 1 Element, Ceramic-Core, SMD, 0201, CHIP, 0201 | MLG0603P4N3ST000 vs CIH03U4N3SNC |
BSCQ000603034N3SHR | Pulse Maglayers | Check for Price | General Purpose Inductor, 0.0043uH, 6.9767%, 1 Element, Ceramic-Core, SMD, 0201, CHIP | MLG0603P4N3ST000 vs BSCQ000603034N3SHR |
SDCL0603Q4N3ST02B03 | Sunlord | Check for Price | General Purpose Inductor, 0.0043uH, 6.9767%, 1 Element, Ceramic-Core, SMD, 0201, CHIP | MLG0603P4N3ST000 vs SDCL0603Q4N3ST02B03 |
NML02D4N3TRF | NIC Components Corp | Check for Price | General Purpose Inductor, 0.0043uH, Ceramic-Core, 0201, | MLG0603P4N3ST000 vs NML02D4N3TRF |
The recommended land pattern for MLG0603P4N3ST000 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to ensure good solderability and to prevent solder bridging.
To prevent damage, handle the MLG0603P4N3ST000 component by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component.
The maximum reflow temperature for MLG0603P4N3ST000 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. Exceeding this temperature may cause damage to the component or affect its reliability.
While the MLG0603P4N3ST000 is designed to be robust, it's essential to evaluate its performance in a high-vibration environment. TDK recommends following the IEC 60068-2-6 standard for vibration testing. If the application exceeds the specified vibration limits, consider using a more robust component or additional mechanical support.
Store MLG0603P4N3ST000 components in their original packaging or in a dry, cool place (less than 30°C and 60% RH). Avoid exposing the components to direct sunlight, moisture, or contaminants. Use anti-static packaging materials and follow proper handling procedures to prevent ESD damage.