Datasheets
ML5800DM by: RF Micro Devices Inc

RF and Baseband Circuit, PQCC32, PLASTIC, LCC-32

Part Details for ML5800DM by RF Micro Devices Inc

Results Overview of ML5800DM by RF Micro Devices Inc

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ML5800DM Information

ML5800DM by RF Micro Devices Inc is a Cordles Telephone IC.
Cordless Telephone ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for ML5800DM

Part # Distributor Description Stock Price Buy
Quest Components TELECOM, CORDLESS, RF AND BASEBAND CIRCUIT, PQCC32 624
  • 1 $3.6000
  • 112 $1.5600
  • 322 $1.4400
$1.4400 / $3.6000 Buy Now

Part Details for ML5800DM

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ML5800DM Part Data Attributes

ML5800DM RF Micro Devices Inc
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ML5800DM RF Micro Devices Inc RF and Baseband Circuit, PQCC32, PLASTIC, LCC-32
Part Life Cycle Code Obsolete
Ihs Manufacturer RF MICRO DEVICES INC
Part Package Code QFJ
Package Description HQCCN,
Pin Count 32
Reach Compliance Code unknown
HTS Code 8542.39.00.01
JESD-30 Code S-PQCC-N32
Length 5 mm
Number of Functions 1
Number of Terminals 32
Operating Temperature-Max 60 °C
Operating Temperature-Min -10 °C
Package Body Material PLASTIC/EPOXY
Package Code HQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG
Qualification Status Not Qualified
Seated Height-Max 1.05 mm
Supply Current-Max 90 mA
Supply Voltage-Nom 3.3 V
Surface Mount YES
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade COMMERCIAL
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 5 mm

Alternate Parts for ML5800DM

This table gives cross-reference parts and alternative options found for ML5800DM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ML5800DM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
ML5800DM-T RF Micro Devices Inc Check for Price RF and Baseband Circuit, PQCC32, PLASTIC, LCC-32 ML5800DM vs ML5800DM-T
Part Number Manufacturer Composite Price Description Compare
ML5800DM-SQ RF Micro Devices Inc Check for Price RF and Baseband Circuit, PQCC32, GREEN, PLASTIC, QFN-32 ML5800DM vs ML5800DM-SQ
UAA3545HL NXP Semiconductors Check for Price IC TELECOM, CORDLESS, RF AND BASEBAND CIRCUIT, PQFP32, 5 X 5 X 1.40 MM, PLASTIC, LQFP-32, Cordless Telephone IC ML5800DM vs UAA3545HL
935202550551 NXP Semiconductors Check for Price IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PQFP32, PLASTIC, SOT-401, LQFP-32, Cordless Telephone IC ML5800DM vs 935202550551
ML13156-8P Lansdale Semiconductor Inc Check for Price RF and Baseband Circuit, Bipolar, PQFP32, PLASTIC, QFP-32 ML5800DM vs ML13156-8P
ML2726DH-T RF Micro Devices Inc Check for Price RF and Baseband Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, GREEN, TQFP-32 ML5800DM vs ML2726DH-T
MC13156FB Freescale Semiconductor Check for Price TELECOM, CORDLESS, RF AND BASEBAND CIRCUIT, PQFP32, PLASTIC, QFP-32 ML5800DM vs MC13156FB
UAA3545HL/C1,118 NXP Semiconductors Check for Price IC TELECOM, CORDLESS, RF AND BASEBAND CIRCUIT, PQFP32, 5 X 5 X 1.40 MM, PLASTIC, LQFP-32, Cordless Telephone IC ML5800DM vs UAA3545HL/C1,118
ML13158-8P Lansdale Semiconductor Inc Check for Price RF and Baseband Circuit, Bipolar, PQFP32, PLASTIC, QFP-32 ML5800DM vs ML13158-8P
MC13158FTB Motorola Semiconductor Products Check for Price RF and Baseband Circuit, Bipolar, PQFP32, PLASTIC, TQFP-32 ML5800DM vs MC13158FTB
ML2726DH RF Micro Devices Inc Check for Price RF and Baseband Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, GREEN, TQFP-32 ML5800DM vs ML2726DH

ML5800DM Related Parts

ML5800DM Frequently Asked Questions (FAQ)

  • A good PCB layout should ensure minimal thermal resistance, use a solid ground plane, and keep sensitive analog signals away from digital signals. Thermal management involves using thermal vias, heat sinks, and thermal interface materials to keep the junction temperature below 150°C.

  • Use a Smith chart or a network analyzer to optimize the input and output impedance matching networks. The goal is to achieve a conjugate match between the device's input/output impedance and the external circuitry to maximize power transfer and minimize reflections.

  • Operate the ML5800DM within the recommended temperature range (-40°C to 85°C), voltage range (2.7V to 5.5V), and current range (up to 1.5A). Avoid exceeding the maximum ratings, and ensure proper thermal management to prevent overheating.

  • Check the PCB layout, input/output matching networks, and power supply quality. Ensure proper decoupling, and verify that the device is operated within the recommended conditions. Use a spectrum analyzer or oscilloscope to identify and debug issues.

  • Handle the device with ESD-protective equipment, and follow proper handling procedures to prevent electrostatic discharge damage. The ML5800DM has built-in ESD protection, but it's still important to take precautions during handling, storage, and assembly.

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