Part Details for MGA-665P8-BLK by Broadcom Limited
Results Overview of MGA-665P8-BLK by Broadcom Limited
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MGA-665P8-BLK Information
MGA-665P8-BLK by Broadcom Limited is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for MGA-665P8-BLK
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MGA-665P8-BLK
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EBV Elektronik | LowNoise Amplifier LNA 05 GHz to 6 GHz 8 Pins LPCC (Alt: MGA-665P8-BLK) RoHS: Compliant Min Qty: 100 Package Multiple: 100 | EBV - 0 |
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Buy Now | |
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Win Source Electronics | IC RF AMP 500MHZ-6GHZ 8LPCC / RF Amplifier IC 500MHz ~ 6GHz 8-LPCC (2x2) | 1171 |
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$13.0573 / $19.5853 | Buy Now |
Part Details for MGA-665P8-BLK
MGA-665P8-BLK CAD Models
MGA-665P8-BLK Part Data Attributes
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MGA-665P8-BLK
Broadcom Limited
Buy Now
Datasheet
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Compare Parts:
MGA-665P8-BLK
Broadcom Limited
Wide Band Low Power Amplifier, 500MHz Min, 6000MHz Max, 1 Func, GAAS, 2 X 2 MM, 0.75 MM HEIGHT, LEAD FREE, LEADLESS, MINIATURE, PLASTIC, DFP-N, LPCC-8
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | BROADCOM INC | |
Package Description | 2 X 2 MM, 0.75 MM HEIGHT, LEAD FREE, LEADLESS, MINIATURE, PLASTIC, DFP-N, LPCC-8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Characteristic Impedance | 50 Ω | |
Construction | COMPONENT | |
Gain | 14.5 dB | |
Input Power-Max (CW) | 13 dBm | |
JESD-609 Code | e3 | |
Mounting Feature | SURFACE MOUNT | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Frequency-Max | 6000 MHz | |
Operating Frequency-Min | 500 MHz | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Equivalence Code | SOLCC8,.08,20 | |
Power Supplies | 3 V | |
RF/Microwave Device Type | WIDE BAND LOW POWER | |
Supply Current-Max | 23.8 mA | |
Surface Mount | YES | |
Technology | GAAS | |
Terminal Finish | Matte Tin (Sn) |
Alternate Parts for MGA-665P8-BLK
This table gives cross-reference parts and alternative options found for MGA-665P8-BLK. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MGA-665P8-BLK, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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MGA-665P8-BLK | Agilent Technologies Inc | Check for Price | Wide Band Low Power Amplifier, 500MHz Min, 6000MHz Max, 1 Func, GAAS, 2 X 2 MM, 0.75 MM HEIGHT, LEAD FREE, LEADLESS, MINIATURE, PLASTIC, LCC-8 | MGA-665P8-BLK vs MGA-665P8-BLK |
MGA-665P8-BLK Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. Use thermal tape or a heat sink for high-power applications.
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Use the device's power-down mode and adjust the bias current to minimize power consumption. Consider using a low-dropout regulator (LDO) to reduce power supply noise and voltage drop.
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Handle the device by the body or pins, avoiding direct contact with the die. Use an anti-static wrist strap or mat, and store the device in an anti-static bag. Follow the JEDEC standard for ESD handling and protection.
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Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply and decoupling capacitors for noise and voltage drops. Consult the datasheet and application notes for troubleshooting guides and FAQs.
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The device is rated for operation up to 125°C junction temperature. Avoid mechanical stress, bending, or twisting, which can cause damage to the internal bonds or die. Follow the recommended PCB layout and assembly guidelines.