Part Details for MCF5216CVM66J by Freescale Semiconductor
Results Overview of MCF5216CVM66J by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
MCF5216CVM66J Information
MCF5216CVM66J by Freescale Semiconductor is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MCF5216CVM66J
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 156 |
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RFQ |
Part Details for MCF5216CVM66J
MCF5216CVM66J CAD Models
MCF5216CVM66J Part Data Attributes
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MCF5216CVM66J
Freescale Semiconductor
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Datasheet
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MCF5216CVM66J
Freescale Semiconductor
IC,MICROCONTROLLER,32-BIT,COLDFIRE CPU,CMOS,BGA,256PIN,PLASTIC
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Reach Compliance Code | unknown | |
| Bit Size | 32 | |
| CPU Family | COLDFIRE | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 65536 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Speed | 66 MHz | |
| Supply Current-Max | 200 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 |