Part Details for MAX3969ETP+ by Maxim Integrated Products
Results Overview of MAX3969ETP+ by Maxim Integrated Products
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MAX3969ETP+ Information
MAX3969ETP+ by Maxim Integrated Products is an ATM/SONET/SDH IC.
ATM/SONET/SDH ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for MAX3969ETP+
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
73Y3806
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Newark | Limiting Amp, 2.97V-5.5V, Tqfn-20, Gain Bandwidth Product:-, Supply Voltage Min:2.97V, Supply Voltage Max:5.5V, Ic Case/Package:Tqfn, No. Of Pins:20Pins, Ic Mounting:Surface Mount, Operating Temperature Min:-40°C, Product Range:- Rohs Compliant: Yes |Maxim Integrated/analog Devices MAX3969ETP+ RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 71 |
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$4.3000 / $7.1200 | Buy Now |
DISTI #
MAX3969ETP+-ND
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DigiKey | IC LIMITING AMP 20TQFN Min Qty: 1 Lead time: 10 Weeks Container: Tube |
60 In Stock |
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$4.1816 / $7.1200 | Buy Now |
Part Details for MAX3969ETP+
MAX3969ETP+ CAD Models
MAX3969ETP+ Part Data Attributes
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MAX3969ETP+
Maxim Integrated Products
Buy Now
Datasheet
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Compare Parts:
MAX3969ETP+
Maxim Integrated Products
Support Circuit, 1-Func, Bipolar, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD-1, TQFN-20
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
Part Package Code | QFN | |
Package Description | 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD-1, TQFN-20 | |
Pin Count | 20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Applications | ATM | |
JESD-30 Code | S-XQCC-N20 | |
JESD-609 Code | e3 | |
Length | 4 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 20 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC20,.16SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.8 mm | |
Supply Current-Max | 0.045 mA | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 4 mm |
Alternate Parts for MAX3969ETP+
This table gives cross-reference parts and alternative options found for MAX3969ETP+. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MAX3969ETP+, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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MAX3969ETP+T | Maxim Integrated Products | $4.3149 | Support Circuit, 1-Func, Bipolar, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD-1, TQFN-20 | MAX3969ETP+ vs MAX3969ETP+T |
MAX3969ETP+T | Analog Devices Inc | Check for Price | 200Mbps SFP Limiting Amplifier, 20-LFCSP-4X4X0.75, 20 Pins, -40 to 85C | MAX3969ETP+ vs MAX3969ETP+T |
MAX3969ETP+ Frequently Asked Questions (FAQ)
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The recommended PCB layout for the MAX3969ETP+ involves placing the device close to the power source, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
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To ensure the MAX3969ETP+ operates within its specified temperature range, it's essential to provide adequate heat sinking, such as using a heat sink or a thermal pad, and ensuring good airflow around the device. Additionally, avoid exposing the device to extreme temperatures during storage or handling.
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The MAX3969ETP+ has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and handling. This includes using an ESD wrist strap, ESD mat, or ESD bag, and ensuring that all equipment and tools are properly grounded.
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Yes, the MAX3969ETP+ is suitable for high-reliability and high-availability applications. However, it's essential to follow proper design and manufacturing guidelines, including using a robust PCB design, selecting high-reliability components, and implementing adequate testing and validation procedures.
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To troubleshoot issues with the MAX3969ETP+, start by verifying the power supply voltage, checking for proper PCB layout and component placement, and ensuring that the device is properly soldered. Use oscilloscopes or logic analyzers to debug the device's output and input signals. Consult the datasheet and application notes for specific troubleshooting guidelines.