Datasheets
M2S150TS-FC1152M by:

Field Programmable Gate Array, PBGA1152, FBGA-1152

Part Details for M2S150TS-FC1152M by Microsemi Corporation

Results Overview of M2S150TS-FC1152M by Microsemi Corporation

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Applications Industrial Automation Transportation and Logistics Renewable Energy Automotive Robotics and Drones

M2S150TS-FC1152M Information

M2S150TS-FC1152M by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Part Details for M2S150TS-FC1152M

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M2S150TS-FC1152M Part Data Attributes

M2S150TS-FC1152M Microsemi Corporation
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M2S150TS-FC1152M Microsemi Corporation Field Programmable Gate Array, PBGA1152, FBGA-1152
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B1152
JESD-609 Code e0
Length 35 mm
Number of Terminals 1152
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.9 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm

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