Part Details for M2S150TS-FC1152I by Microsemi Corporation
Results Overview of M2S150TS-FC1152I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2S150TS-FC1152I Information
M2S150TS-FC1152I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2S150TS-FC1152I
M2S150TS-FC1152I CAD Models
M2S150TS-FC1152I Part Data Attributes
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M2S150TS-FC1152I
Microsemi Corporation
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Datasheet
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M2S150TS-FC1152I
Microsemi Corporation
Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152, FBGA-1152
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B1152 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Number of Inputs | 574 | |
| Number of Logic Cells | 146124 | |
| Number of Outputs | 574 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 240 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.9 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 35 mm |
Alternate Parts for M2S150TS-FC1152I
This table gives cross-reference parts and alternative options found for M2S150TS-FC1152I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2S150TS-FC1152I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| M2S150TS-FCG1152I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152, FBGA-1152 | M2S150TS-FC1152I vs M2S150TS-FCG1152I |
| M2S150TS-FCG1152 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152, FBGA-1152 | M2S150TS-FC1152I vs M2S150TS-FCG1152 |
| M2S150TS-FC1152 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 146124-Cell, CMOS, PBGA1152, FBGA-1152 | M2S150TS-FC1152I vs M2S150TS-FC1152 |
M2S150TS-FC1152I Frequently Asked Questions (FAQ)
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Microsemi provides a reference design guide and thermal management application note (AN-115) that outlines recommended PCB layout, thermal vias, and heat sink design for optimal performance and reliability.
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Microsemi provides the Libero SoC Design Suite, which includes a comprehensive development environment for designing, implementing, and verifying the configuration and programming of the FPGA. The suite includes tools for HDL design, synthesis, place-and-route, and debugging.
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The M2S150TS-FC1152I requires a specific power sequencing and voltage regulation scheme to ensure proper operation. Microsemi recommends using a power management IC (PMIC) such as the Microsemi Power Manager (MPM) or a custom power supply design that meets the FPGA's power requirements.
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Microsemi provides guidelines for signal integrity and EMI mitigation in the M2S150TS-FC1152I datasheet and application notes. These guidelines include recommendations for PCB layout, signal routing, and termination, as well as EMI shielding and filtering techniques.
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The M2S150TS-FC1152I is qualified for operation in a variety of environmental and operating conditions, including temperature ranges from -40°C to 100°C, humidity, and vibration. Refer to the datasheet and reliability report for specific details on the FPGA's environmental and operating conditions.