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Programmable Logic / Field Programmable Gate Arrays / M2S090-FGG484I
Datasheets
M2S090-FGG484I by:

Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484, FBGA-484

Part Details for M2S090-FGG484I by Microsemi Corporation

Results Overview of M2S090-FGG484I by Microsemi Corporation

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M2S090-FGG484I Information

M2S090-FGG484I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for M2S090-FGG484I

Part # Distributor Description Stock Price Buy
Vyrian Programmable ICs 85
RFQ

Part Details for M2S090-FGG484I

M2S090-FGG484I CAD Models

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M2S090-FGG484I Part Data Attributes

Parametric Data
M2S090-FGG484I Microsemi Corporation
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M2S090-FGG484I Microsemi Corporation Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484, FBGA-484
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description FBGA-484
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
JESD-30 Code S-PBGA-B484
JESD-609 Code e1
Length 23 mm
Moisture Sensitivity Level 3
Number of Inputs 267
Number of Logic Cells 86316
Number of Outputs 267
Number of Terminals 484
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.44 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 23 mm

Alternate Parts for M2S090-FGG484I

This table gives cross-reference parts and alternative options found for M2S090-FGG484I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2S090-FGG484I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
M2S090-FG676 Microsemi Corporation Check for Price Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676, FBGA-676 M2S090-FGG484I vs M2S090-FG676
Part Number Manufacturer Composite Price Description Compare
M2S090-FGG676 Microsemi Corporation Check for Price Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676, FBGA-676 M2S090-FGG484I vs M2S090-FGG676
M2S090-FG484 Microsemi Corporation Check for Price Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484, FBGA-484 M2S090-FGG484I vs M2S090-FG484
M2S090-FG484I Microsemi Corporation Check for Price Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484, FBGA-484 M2S090-FGG484I vs M2S090-FG484I
M2S090-FGG676I Microsemi Corporation Check for Price Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676, FBGA-676 M2S090-FGG484I vs M2S090-FGG676I
M2S090-FG676I Microsemi Corporation Check for Price Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676, FBGA-676 M2S090-FGG484I vs M2S090-FG676I

M2S090-FGG484I Related Parts

M2S090-FGG484I Frequently Asked Questions (FAQ)

  • Microsemi provides a PCB design guide that includes layout and routing guidelines for the M2S090-FGG484I. It's recommended to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).

  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi LX7167, which provides a reset signal to the FPGA during power-up. The POR circuit should be designed to ensure that the FPGA is held in reset until the power supply voltages are stable.

  • The M2S090-FGG484I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal modeling and simulation tools to help with thermal design.

  • Microsemi provides a range of security features, including AES encryption, secure boot, and anti-tamper protection. Additionally, designers can implement their own security measures, such as secure key storage and access control, to protect their IP and prevent unauthorized access.

  • The M2S090-FGG484I is designed to withstand the harsh radiation environments found in space and aerospace applications. It features radiation-hardened flip-flops, memory, and other components, which provide immunity to single-event effects (SEEs) and total ionizing dose (TID) effects.

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