Part Details for M2S090-FGG484I by Microchip Technology Inc

Microchip provides a PCB design guide for the M2S090-FGG484I, which recommends a 4-layer PCB stackup with a solid ground plane, and suggests using differential pairs for clock and high-speed signals. Additionally, it's recommended to keep sensitive analog signals away from noisy digital signals.

A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP112-315JE/OT, which can detect the power supply voltage and generate a reset signal to the FPGA. The FPGA's internal POR circuit can also be used in conjunction with an external voltage supervisor.

To ensure reliable operation, it's essential to provide adequate heat dissipation for the FPGA. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the device. The FPGA's thermal design power (TDP) should also be considered when designing the system's thermal management strategy.

To minimize clock jitter and skew, it's recommended to use a high-quality clock source, such as a crystal oscillator or a low-jitter clock generator. The FPGA's internal clocking resources, such as the clock management tile (CMT), can also be used to generate and distribute clocks. Additionally, careful PCB layout and routing of clock signals can help minimize jitter and skew.

The M2S090-FGG484I FPGA has built-in security features, including a secure boot mechanism and AES encryption. To implement secure boot, the FPGA's boot ROM can be used to authenticate the firmware image. Firmware encryption can be achieved using the AES encryption engine, and secure key storage can be implemented using the FPGA's secure key storage registers.