Part Details for M2S010-VFG256 by Microsemi Corporation
Results Overview of M2S010-VFG256 by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M2S010-VFG256 Information
M2S010-VFG256 by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S010-VFG256
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 170 |
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RFQ |
Part Details for M2S010-VFG256
M2S010-VFG256 CAD Models
M2S010-VFG256 Part Data Attributes
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M2S010-VFG256
Microsemi Corporation
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Datasheet
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M2S010-VFG256
Microsemi Corporation
Field Programmable Gate Array, 12084-Cell, CMOS, PBGA256, VFBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | VFBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Additional Feature | LG-MIN, WD-MIN | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 138 | |
| Number of Logic Cells | 12084 | |
| Number of Outputs | 138 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA256,16X16,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.56 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 14 mm |
Alternate Parts for M2S010-VFG256
This table gives cross-reference parts and alternative options found for M2S010-VFG256. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2S010-VFG256, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2S010-VFG400 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 12084-Cell, CMOS, PBGA400, VFBGA-400 | M2S010-VFG256 vs M2S010-VFG400 |
| M2S010-VF256 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 12084-Cell, CMOS, PBGA256, VFBGA-256 | M2S010-VFG256 vs M2S010-VF256 |
| M2S010-VF400 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 9744-Cell, CMOS, PBGA400, VFBGA-400 | M2S010-VFG256 vs M2S010-VF400 |
| M2S010-VFG256I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 12084-Cell, CMOS, PBGA256, VFBGA-256 | M2S010-VFG256 vs M2S010-VFG256I |
M2S010-VFG256 Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide for the M2S010-VFG256, which includes guidelines for PCB layout, routing, and signal integrity. It's recommended to follow these guidelines to ensure optimal performance and signal quality.
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA. The FPGA's internal POR circuit can also be used in conjunction with an external voltage supervisor IC.
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Best practices for clock management include using the FPGA's internal clock generators and phase-locked loops (PLLs) to generate stable clock signals, and using clock domain crossing (CDC) techniques to synchronize clock domains. It's also recommended to use the FPGA's built-in clock monitoring and jitter filtering capabilities.
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Optimizing power consumption and thermal performance can be achieved by using the FPGA's power management features, such as dynamic voltage and frequency scaling, and clock gating. Additionally, using low-power modes, such as sleep mode, and optimizing the FPGA's clock tree can also help reduce power consumption.
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Recommended design practices for high-speed interfaces include using the FPGA's built-in PHYs and controllers, following the interface specifications and guidelines, and using signal integrity analysis tools to optimize signal routing and termination. It's also recommended to use the FPGA's built-in error correction and detection mechanisms to ensure data integrity.