Part Details for M2GL050-FG896I by Microsemi Corporation
Results Overview of M2GL050-FG896I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2GL050-FG896I Information
M2GL050-FG896I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2GL050-FG896I
M2GL050-FG896I CAD Models
M2GL050-FG896I Part Data Attributes
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M2GL050-FG896I
Microsemi Corporation
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Datasheet
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M2GL050-FG896I
Microsemi Corporation
Field Programmable Gate Array, 56340-Cell, CMOS, PBGA896, 31 X 31 MM, 1 MM PITCH, FBGA-896
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 31 X 31 MM, 1 MM PITCH, FBGA-896 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B896 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 377 | |
| Number of Logic Cells | 56340 | |
| Number of Outputs | 377 | |
| Number of Terminals | 896 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm |
Alternate Parts for M2GL050-FG896I
This table gives cross-reference parts and alternative options found for M2GL050-FG896I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2GL050-FG896I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2GL050-FG896I | Microchip Technology Inc | $154.5138 | Field Programmable Gate Array, 56340-Cell, CMOS, PBGA896 | M2GL050-FG896I vs M2GL050-FG896I |
| M2S050-1FGG896 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 56340-Cell, CMOS, PBGA896, FBGA-896 | M2GL050-FG896I vs M2S050-1FGG896 |
M2GL050-FG896I Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide and layout recommendations in their documentation, including the 'M2GL050-FG896I FPGA PCB Design Guidelines' document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet timing requirements.
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To optimize power consumption, use the Microsemi Libero SoC design software to analyze and optimize power consumption during the design process. Additionally, consider using power-saving features like clock gating, dynamic voltage and frequency scaling, and shutdown modes for unused blocks.
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The M2GL050-FG896I has a maximum junction temperature of 100°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed PCB with adequate thermal vias. Also, consider using thermal simulation tools to analyze and optimize the thermal performance of the design.
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Microsemi provides a range of security features, including AES encryption, secure boot, and anti-tamper protection. Implement these features in your design, and consider using secure protocols for communication and data storage. Additionally, follow secure coding practices and use secure development tools to minimize the risk of vulnerabilities.
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Microsemi provides the Libero SoC design software, which includes a comprehensive development environment for designing, simulating, and implementing digital designs on the M2GL050-FG896I FPGA. Additionally, third-party tools like ModelSim and Synplify are also supported.