Part Details for M1A3P600-FGG144I by Microchip Technology Inc
Results Overview of M1A3P600-FGG144I by Microchip Technology Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M1A3P600-FGG144I Information
M1A3P600-FGG144I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M1A3P600-FGG144I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ7642
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Newark | Proasic3 Fpga, Arm Cortex-M1, 7Kles 144 Lfbga 13X13X1.55Mm Tray Rohs Compliant: Yes |Microchip M1A3P600-FGG144I RoHS: Compliant Min Qty: 160 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$52.6200 / $59.1900 | Buy Now |
DISTI #
M1A3P600-FGG144I-ND
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DigiKey | IC FPGA 97 I/O 144FBGA Min Qty: 160 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$59.1901 | Buy Now |
DISTI #
M1A3P600-FGG144I
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Avnet Americas | FPGA ProASIC3 Family 600K Gates 231MHz 130nm (CMOS) Technology 1.5V 144-Pin F-BGA - Trays (Alt: M1A3P600-FGG144I) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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$52.6200 / $60.1300 | Buy Now |
DISTI #
494-M1A3P600-FGG144I
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Mouser Electronics | FPGA - Field Programmable Gate Array ProASIC3 FPGA, ARM Cortex-M1, 7KLEs RoHS: Compliant | 0 |
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$59.1900 | Order Now |
DISTI #
M1A3P600-FGG144I
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Microchip Technology Inc | ProASIC3 FPGA, ARM Cortex-M1, 7KLEs, LFBGA, Projected EOL: 2049-02-04 COO: Malaysia ECCN: EAR99 RoHS: Compliant Container: Tray |
16 Alternates Available |
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$28.9200 / $60.1300 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$53.3600 / $150.0100 | Buy Now |
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Quest Components | 320 |
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$313.3704 / $365.5988 | Buy Now | |
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NAC | M1A3P600-FGG144I RoHS: Compliant Min Qty: 160 Package Multiple: 160 Container: Tray | 0 |
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$50.8200 / $59.5300 | Buy Now |
DISTI #
M1A3P600-FGG144I
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Avnet Silica | FPGA ProASIC3 Family 600K Gates 231MHz 130nm CMOS Technology 15V 144Pin FBGA (Alt: M1A3P600-FGG144I) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
M1A3P600-FGG144I
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EBV Elektronik | FPGA ProASIC3 Family 600K Gates 231MHz 130nm CMOS Technology 15V 144Pin FBGA (Alt: M1A3P600-FGG144I) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for M1A3P600-FGG144I
M1A3P600-FGG144I CAD Models
M1A3P600-FGG144I Part Data Attributes
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M1A3P600-FGG144I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M1A3P600-FGG144I
Microchip Technology Inc
Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PBGA144
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | FBGA-144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 111 Weeks | |
Clock Frequency-Max | 350 MHz | |
JESD-30 Code | S-PBGA-B144 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 13824 | |
Number of Equivalent Gates | 600000 | |
Number of Inputs | 97 | |
Number of Outputs | 97 | |
Number of Terminals | 144 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 13824 CLBS, 600000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA144,12X12,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Packing Method | TRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm |
Alternate Parts for M1A3P600-FGG144I
This table gives cross-reference parts and alternative options found for M1A3P600-FGG144I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M1A3P600-FGG144I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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M1A3P600-FGG144 | Microchip Technology Inc | $58.3996 | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, CMOS, PBGA144 | M1A3P600-FGG144I vs M1A3P600-FGG144 |
M1A3P600-FGG144I Frequently Asked Questions (FAQ)
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Microchip provides a reference design and layout guidelines in the M1A3P600-FGG144I datasheet and application notes. Additionally, it's recommended to follow general PCB design best practices for high-frequency and high-power devices, such as using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat.
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To optimize power consumption and reduce heat generation, ensure that the device is operated within the recommended voltage and frequency ranges. Implement power-saving features such as clock gating, dynamic voltage and frequency scaling, and use low-power modes when possible. Additionally, optimize the system's firmware and software to minimize unnecessary computations and reduce switching activity.
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The recommended settings for the PLL and clocking system can be found in the M1A3P600-FGG144I datasheet and application notes. In general, it's recommended to follow the guidelines for PLL configuration, clock frequency selection, and clock distribution to ensure stable and reliable operation.
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To ensure reliable and secure boot-up and firmware updates, implement a secure boot mechanism using the device's built-in security features, such as secure boot keys and authentication mechanisms. Use a trusted firmware update mechanism, such as secure firmware over-the-air (FOTA) updates, and ensure that the update process is validated and authenticated.
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To ensure EMI and EMC compliance, follow the guidelines for PCB design, component selection, and system integration provided in the M1A3P600-FGG144I datasheet and application notes. Implement EMI filtering and shielding, and ensure that the system meets the relevant regulatory requirements and standards.