Part Details for LXP1002-23-4 by Microsemi Corporation
Results Overview of LXP1002-23-4 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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LXP1002-23-4 Information
LXP1002-23-4 by Microsemi Corporation is a PIN Diode.
PIN Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for LXP1002-23-4
LXP1002-23-4 CAD Models
LXP1002-23-4 Part Data Attributes
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LXP1002-23-4
Microsemi Corporation
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Datasheet
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LXP1002-23-4
Microsemi Corporation
Pin Diode, 100V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | ROHS COMPLIANT PACKAGE-3 | |
| Pin Count | 3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Application | ATTENUATOR | |
| Breakdown Voltage-Min | 100 V | |
| Configuration | COMMON CATHODE, 2 ELEMENTS | |
| Diode Capacitance-Max | 0.32 pF | |
| Diode Capacitance-Nom | 0.32 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 4 Ω | |
| Diode Res Test Current | 100 mA | |
| Diode Res Test Frequency | 100 MHz | |
| Diode Type | PIN DIODE | |
| Frequency Band | L BAND | |
| JESD-30 Code | R-PDSO-G3 | |
| Minority Carrier Lifetime-Nom | 1.5 µs | |
| Number of Elements | 2 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 125 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Power Dissipation-Max | 0.25 W | |
| Qualification Status | Not Qualified | |
| Reverse Test Voltage | 50 V | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL |
Alternate Parts for LXP1002-23-4
This table gives cross-reference parts and alternative options found for LXP1002-23-4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LXP1002-23-4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| LXP1000-23-0 | Microsemi Corporation | Check for Price | Pin Diode, 35V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 | LXP1002-23-4 vs LXP1000-23-0 |
| LXP1010-23-5 | Microsemi Corporation | Check for Price | Pin Diode, 100V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 | LXP1002-23-4 vs LXP1010-23-5 |
| LXP1008-23-2 | Microsemi Corporation | Check for Price | Pin Diode, 50V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 | LXP1002-23-4 vs LXP1008-23-2 |
| LXP1010-23-0 | Microsemi Corporation | Check for Price | Pin Diode, 100V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 | LXP1002-23-4 vs LXP1010-23-0 |
| LXP1004-23-0 | Microsemi Corporation | Check for Price | Pin Diode, 35V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 | LXP1002-23-4 vs LXP1004-23-0 |
| LXP1005-23-0 | Microsemi Corporation | Check for Price | Pin Diode, 100V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 | LXP1002-23-4 vs LXP1005-23-0 |
LXP1002-23-4 Frequently Asked Questions (FAQ)
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Microsemi recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a thermal plane or a heat sink.
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Use a robust power supply design, ensure proper thermal management, and follow the recommended operating conditions. Additionally, consider using a temperature sensor to monitor the device temperature and adjust the operating conditions accordingly.
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The LXP1002-23-4 is designed to meet EMI and RFI requirements. However, proper PCB layout, shielding, and filtering are still necessary to minimize electromagnetic interference. Follow Microsemi's application notes and guidelines for EMI and RFI mitigation.
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Yes, the LXP1002-23-4 is designed for high-reliability applications. However, it's essential to follow Microsemi's guidelines for screening, testing, and qualification for aerospace and high-reliability applications.
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The LXP1002-23-4 is designed to be radiation-tolerant and latch-up immune. However, the specific radiation tolerance and latch-up characteristics depend on the application and environment. Consult Microsemi's radiation and latch-up testing reports for more information.