Part Details for LE79124KVC by Microchip Technology Inc
Results Overview of LE79124KVC by Microchip Technology Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
LE79124KVC Information
LE79124KVC by Microchip Technology Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for LE79124KVC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
03AH2185
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Newark | Vcpng,72Ch, data Ag, lntest, Tqfp128 128 Tqfp 14X14X1Mm Tray Rohs Compliant: Yes |Microchip LE79124KVC RoHS: Compliant Min Qty: 450 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$15.2400 | Buy Now |
DISTI #
LE79124KVC-ND
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DigiKey | IC TELECOM INTERFACE 128TQFP Min Qty: 450 Lead time: 4 Weeks Container: Tray | Temporarily Out of Stock |
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$16.1875 | Buy Now |
DISTI #
LE79124KVC
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Avnet Americas | Voice Control Processor 128-Pin TQFP Tray - Trays (Alt: LE79124KVC) RoHS: Not Compliant Min Qty: 450 Package Multiple: 450 Lead time: 4 Weeks, 0 Days Container: Tray | 0 |
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$15.2400 / $20.1100 | Buy Now |
DISTI #
494-LE79124KVC
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Mouser Electronics | Telecom Interface ICs VCPNG,72CH,DATA AG,LNTEST, TQFP128 RoHS: Compliant | 0 |
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$16.1800 | Order Now |
DISTI #
LE79124KVC
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Microchip Technology Inc | VCPNG,72CH,DATA AG,LNTEST, TQFP128, TQFP, Projected EOL: 2044-04-25 COO: Malaysia ECCN: EAR99 RoHS: Compliant Lead time: 1 Weeks, 0 Days Container: Tray |
11495 Alternates Available |
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$14.5500 / $20.1100 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 11250 Factory Stock |
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$16.5600 / $46.4100 | Buy Now |
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NAC | VCPNG,72CH,DATA AG,LNTEST, TQFP128, 128 TQFP 14x14x1mm TRAY RoHS: Compliant Min Qty: 450 Package Multiple: 450 | 0 |
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$15.7900 / $18.5000 | Buy Now |
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Master Electronics | RoHS: Compliant | 11250 Factory Stock |
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$16.5600 / $46.4100 | Buy Now |
Part Details for LE79124KVC
LE79124KVC CAD Models
LE79124KVC Part Data Attributes
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LE79124KVC
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
LE79124KVC
Microchip Technology Inc
Digital Signal Processor, CMOS, PQFP128
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | TQFP-128 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Address Bus Width | 1 | |
Barrel Shifter | NO | |
Bit Size | 16 | |
Boundary Scan | NO | |
Clock Frequency-Max | 16.384 MHz | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Integrated Cache | NO | |
Internal Bus Architecture | SINGLE | |
JESD-30 Code | S-PQFP-G128 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Low Power Mode | YES | |
Number of Serial I/Os | 1 | |
Number of Terminals | 128 | |
Number of Timers | 2 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP128,.63SQ,16 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.4 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |
Alternate Parts for LE79124KVC
This table gives cross-reference parts and alternative options found for LE79124KVC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LE79124KVC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
LE79124GDG | Microchip Technology Inc | Check for Price | Digital Signal Processor, CMOS, PBGA144 | LE79124KVC vs LE79124GDG |
LE79124KVC Frequently Asked Questions (FAQ)
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Microchip provides a recommended PCB layout in the LE79124KVC evaluation board documentation, which includes guidelines for component placement, thermal management, and routing. Following this layout can help minimize noise, reduce EMI, and ensure optimal performance.
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The input capacitor values depend on the input voltage, output voltage, and desired ripple current. A general rule of thumb is to use a capacitor with a value of 10-22uF, 50-100V, and a low ESR (Equivalent Series Resistance). Consult the datasheet and application notes for more specific guidance.
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The LE79124KVC is rated for operation up to 125°C (TJ) junction temperature. However, for reliable operation, it's recommended to keep the ambient temperature below 85°C to ensure a safe margin for thermal management.
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Follow the power-up sequence outlined in the datasheet, which includes applying the input voltage, waiting for the internal voltage regulator to stabilize, and then enabling the device. Additionally, ensure that the EN pin is properly driven and the device is in a valid operating mode.
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Proper thermal management is crucial for the LE79124KVC. Ensure good airflow, use a heat sink with a thermal resistance of <1°C/W, and apply a thermal interface material (TIM) with a thermal conductivity of >1 W/m-K. Consult the datasheet and application notes for more detailed guidance.