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Part Details for LCMXO2-640ZE-1TG100I by Lattice Semiconductor Corporation
Results Overview of LCMXO2-640ZE-1TG100I by Lattice Semiconductor Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Automotive
LCMXO2-640ZE-1TG100I Information
LCMXO2-640ZE-1TG100I by Lattice Semiconductor Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for LCMXO2-640ZE-1TG100I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
48W6137
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Newark | Fpga, 640 Logic Cell, Tqfp-100, 100Deg C, Fpga Type:Flash Based Fpga, No. Of Logic Cells:640Logic Cells, Ic Case/Package:Tqfp, No. Of Pins:100Pins, Speed Grade:1, No.of User I/Os:78I/O S, Process Technology:65Nm, Product Range:- Rohs Compliant: Yes |Lattice Semiconductor LCMXO2-640ZE-1TG100I RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 3 |
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$4.3100 | Buy Now |
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DISTI #
220-1499-ND
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DigiKey | IC FPGA 78 I/O 100TQFP Min Qty: 90 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$9.7500 | Buy Now |
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DISTI #
842-XO2640ZE1TG100I
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Mouser Electronics | FPGA - Field Programmable Gate Array 640 LUTs 79 IO 1.2V 1 Spd RoHS: Compliant | 0 |
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$9.4300 | Order Now |
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DISTI #
LCMXO2640ZE1TG10I
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TME | IC: CPLD, SMD, LQFP100, Number of macrocells: 320, I/O: 79, 5kBRAM Min Qty: 1 | 0 |
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$8.5400 / $12.4000 | RFQ |
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Vyrian | Programmable ICs | 274 |
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RFQ |
Part Details for LCMXO2-640ZE-1TG100I
LCMXO2-640ZE-1TG100I CAD Models
LCMXO2-640ZE-1TG100I Part Data Attributes
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LCMXO2-640ZE-1TG100I
Lattice Semiconductor Corporation
Buy Now
Datasheet
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Compare Parts:
LCMXO2-640ZE-1TG100I
Lattice Semiconductor Corporation
Field Programmable Gate Array, 640-Cell, CMOS, PQFP100, TQFP-100
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Lattice Semiconductor | |
| Clock Frequency-Max | 93.1 MHz | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 80 | |
| Number of Inputs | 78 | |
| Number of Logic Cells | 640 | |
| Number of Outputs | 78 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 80 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Packing Method | TRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |
Alternate Parts for LCMXO2-640ZE-1TG100I
This table gives cross-reference parts and alternative options found for LCMXO2-640ZE-1TG100I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LCMXO2-640ZE-1TG100I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LCMXO2-640ZE-2TG100C | Lattice Semiconductor Corporation | $12.8920 | Field Programmable Gate Array, 640-Cell, CMOS, PQFP100, TQFP-100 | LCMXO2-640ZE-1TG100I vs LCMXO2-640ZE-2TG100C |
| LCMXO2-640ZE-2TG100I | Lattice Semiconductor Corporation | $13.7141 | Field Programmable Gate Array, 640-Cell, CMOS, PQFP100, TQFP-100 | LCMXO2-640ZE-1TG100I vs LCMXO2-640ZE-2TG100I |
LCMXO2-640ZE-1TG100I Frequently Asked Questions (FAQ)
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Lattice provides a PCB layout and routing guide for the LCMXO2 family, which includes recommendations for signal integrity, power distribution, and thermal management. It's available on the Lattice website.
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Lattice recommends using a daisy-chain configuration for JTAG, with each device having its own TCK, TMS, and TDI pins. The TDO pin of each device should be connected to the TDI pin of the next device in the chain. Additionally, use a JTAG buffer or repeater to ensure signal integrity.
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The LCMXO2-640ZE-1TG100I requires a specific power sequencing order to ensure proper operation. The recommended sequence is: VCCIO, VCC, VCCAUX, and then VREF. The power supplies should be ramped up slowly (typically 10-20 ms) to prevent damage to the device.
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Lattice provides a Power Calculator tool that can help estimate power consumption based on the device's configuration and operating conditions. Additionally, implementing power-saving techniques such as clock gating, dynamic voltage and frequency scaling, and using low-power modes can help reduce power consumption.
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The LCMXO2-640ZE-1TG100I has a maximum junction temperature of 100°C. To ensure reliable operation, the device should be mounted on a PCB with a thermal pad connected to a heat sink or a thermal via. The PCB should also be designed to dissipate heat efficiently.