Part Details for LAN8720ACP-ABC by Microchip Technology Inc
Results Overview of LAN8720ACP-ABC by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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LAN8720ACP-ABC Information
LAN8720ACP-ABC by Microchip Technology Inc is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for LAN8720ACP-ABC
LAN8720ACP-ABC CAD Models
LAN8720ACP-ABC Part Data Attributes
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LAN8720ACP-ABC
Microchip Technology Inc
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Datasheet
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LAN8720ACP-ABC
Microchip Technology Inc
Ethernet Transceiver
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | HVQCCN, LCC24,.16SQ,20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2016-06-24 | |
| Data Rate | 100000 Mbps | |
| JESD-30 Code | S-XQCC-N24 | |
| JESD-609 Code | e3 | |
| Length | 4 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Transceivers | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC24,.16SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Screening Level | TS 16949 | |
| Seated Height-Max | 1 mm | |
| Supply Current-Max | 54 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | ETHERNET TRANSCEIVER | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4 mm |
Alternate Parts for LAN8720ACP-ABC
This table gives cross-reference parts and alternative options found for LAN8720ACP-ABC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LAN8720ACP-ABC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LAN8720A-CP-ABC | Microchip Technology Inc | $0.9707 | IC TXRX ETHERNET 24QFN | LAN8720ACP-ABC vs LAN8720A-CP-ABC |
| LAN8720A-CP-TR-ABC | Microchip Technology Inc | $1.1915 | IC TXRX ETHERNET 24QFN | LAN8720ACP-ABC vs LAN8720A-CP-TR-ABC |
LAN8720ACP-ABC Frequently Asked Questions (FAQ)
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Microchip provides a recommended PCB layout guide in the LAN8720A-CP-ABC evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management.
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The LAN8720A-CP-ABC can be configured for different PHY modes (e.g., 10BASE-T, 100BASE-TX, 1000BASE-T) using the device's strap pins or through software configuration using the MDIO interface.
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The LAN8720A-CP-ABC supports cable lengths up to 100 meters for 1000BASE-T and 100BASE-TX modes, and up to 200 meters for 10BASE-T mode, assuming a Category 5e or higher cable.
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The LAN8720A-CP-ABC has a built-in power management feature that can be controlled through the PMDIO interface. Additionally, the device can be powered down or put into a low-power state using the PWON pin.
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The LAN8720A-CP-ABC has a maximum junction temperature of 125°C. Thermal management considerations include providing adequate heat sinking, using thermal vias, and ensuring good airflow around the device.