Part Details for IS61QDB22M18A-250M3LI by Integrated Silicon Solution Inc
Results Overview of IS61QDB22M18A-250M3LI by Integrated Silicon Solution Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
IS61QDB22M18A-250M3LI Information
IS61QDB22M18A-250M3LI by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS61QDB22M18A-250M3LI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
77T0725
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Newark | 36Mb, Quad (Burst Of 2), Sync Sram, 2M X 18, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution/issi IS61QDB22M18A-250M3LI RoHS: Not Compliant Min Qty: 105 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$41.2700 | Buy Now |
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DISTI #
IS61QDB22M18A-250M3LI-ND
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DigiKey | IC SRAM 36MBIT PARALLEL 165LFBGA Min Qty: 105 Lead time: 28 Weeks Container: Tray | Limited Supply - Call |
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$44.9607 | Buy Now |
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DISTI #
IS61QDB22M18A-250M3LI
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Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: IS61QDB22M18A-250M3LI) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 28 Weeks, 0 Days Container: Bulk | 0 |
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$43.1622 / $44.0615 | Buy Now |
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DISTI #
870-61B22M18A250M3LI
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Mouser Electronics | SRAM 36Mb, QUAD (Burst of 2), Sync SRAM, 2M x 18, 165 Ball FBGA (15x17 mm), RoHS RoHS: Compliant | 0 |
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$45.2600 | Order Now |
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DISTI #
IS61QDB22M18A-250M3LI
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Avnet Silica | SRAM Chip Sync Dual 18V 36MBit 2M x 18 045ns 165Pin FBGA (Alt: IS61QDB22M18A-250M3LI) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS61QDB22M18A-250M3LI
IS61QDB22M18A-250M3LI CAD Models
IS61QDB22M18A-250M3LI Part Data Attributes
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IS61QDB22M18A-250M3LI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS61QDB22M18A-250M3LI
Integrated Silicon Solution Inc
QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 28 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.27 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.95 mA | |
| Supply Voltage-Max (Vsup) | 1.89 V | |
| Supply Voltage-Min (Vsup) | 1.71 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for IS61QDB22M18A-250M3LI
This table gives cross-reference parts and alternative options found for IS61QDB22M18A-250M3LI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61QDB22M18A-250M3LI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| IS61QDB22M18C-250M3 | Integrated Silicon Solution Inc | Check for Price | QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | IS61QDB22M18A-250M3LI vs IS61QDB22M18C-250M3 |
| IS61QDB22M18A-250M3I | Integrated Silicon Solution Inc | Check for Price | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | IS61QDB22M18A-250M3LI vs IS61QDB22M18A-250M3I |
| IS61QDB22M18A-250M3 | Integrated Silicon Solution Inc | Check for Price | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | IS61QDB22M18A-250M3LI vs IS61QDB22M18A-250M3 |
IS61QDB22M18A-250M3LI Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the IS61QDB22M18A-250M3LI is -40°C to 85°C.
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To ensure data integrity during power-up and power-down sequences, it is recommended to follow the power-up and power-down sequencing guidelines provided in the datasheet, and to use a voltage supervisor or reset circuit to ensure that the device is properly initialized and reset.
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The recommended PCB layout and routing for the IS61QDB22M18A-250M3LI involves following good high-speed design practices, such as using a solid ground plane, minimizing signal trace lengths, and avoiding signal routing near the device's power pins. Additionally, it is recommended to follow the layout guidelines provided in the datasheet and to use a 4-layer PCB with a dedicated power plane and ground plane.
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To handle errors and exceptions during device operation, it is recommended to implement error detection and correction mechanisms, such as ECC (Error-Correcting Code) or CRC (Cyclic Redundancy Check), and to use the device's built-in error detection and reporting features. Additionally, it is recommended to implement a robust error handling routine that can detect and recover from errors and exceptions.
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The recommended method for programming and configuring the IS61QDB22M18A-250M3LI involves using the device's built-in programming interface, such as the JTAG or I2C interface, and following the programming and configuration guidelines provided in the datasheet. Additionally, it is recommended to use a programming tool or software provided by the manufacturer or a third-party vendor.