Part Details for IS43R83200D-5TL-TR by Integrated Silicon Solution Inc
Results Overview of IS43R83200D-5TL-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
IS43R83200D-5TL-TR Information
IS43R83200D-5TL-TR by Integrated Silicon Solution Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS43R83200D-5TL-TR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS43R83200D-5TL-TR-ND
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DigiKey | IC DRAM 256MBIT PAR 66TSOP II Min Qty: 1500 Lead time: 10 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$4.5095 | Buy Now |
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DISTI #
IS43R83200D-5TL-TR
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Avnet Americas | - Tape and Reel (Alt: IS43R83200D-5TL-TR) RoHS: Compliant Min Qty: 1500 Package Multiple: 1500 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
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DISTI #
870-IS43R83200D5TLTR
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Mouser Electronics | DRAM 256M, 2.5V, DDR, 32Mx8, 200MHz, 66 pin TSOP II (400 mil) RoHS, T&R RoHS: Compliant | 0 |
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$4.5000 | Order Now |
Part Details for IS43R83200D-5TL-TR
IS43R83200D-5TL-TR CAD Models
IS43R83200D-5TL-TR Part Data Attributes
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IS43R83200D-5TL-TR
Integrated Silicon Solution Inc
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Datasheet
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IS43R83200D-5TL-TR
Integrated Silicon Solution Inc
DDR DRAM, 32MX8, 0.7ns, CMOS, PDSO66,
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TSSOP, TSSOP66,.46 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Factory Lead Time | 8 Weeks | |
| Access Time-Max | 0.7 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 2,4,8 | |
| JESD-30 Code | R-PDSO-G66 | |
| Memory Density | 268435456 bit | |
| Memory IC Type | DDR1 DRAM | |
| Memory Width | 8 | |
| Number of Terminals | 66 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP66,.46 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Sequential Burst Length | 2,4,8 | |
| Standby Current-Max | 0.004 A | |
| Supply Current-Max | 0.48 mA | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL |