Part Details for IS43LR16200D-6BLI-TR by Integrated Silicon Solution Inc
Results Overview of IS43LR16200D-6BLI-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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IS43LR16200D-6BLI-TR Information
IS43LR16200D-6BLI-TR by Integrated Silicon Solution Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS43LR16200D-6BLI-TR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
81Y1291
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Newark | 32M, 1.8V, Mobile Ddr, 2Mx16, 166Mhz, 60 Ball Bga (8Mm X 10Mm) Rohs, It, T&r |Integrated Silicon Solution/issi IS43LR16200D-6BLI-TR RoHS: Not Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$2.0600 / $2.6300 | Buy Now |
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DISTI #
IS43LR16200D-6BLI-
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Avnet Americas | Mobile DDR DRAM 32Mb 2Mx16 166MHz 1.8V 6ns 60-Pin BGA T/R - Tape and Reel (Alt: IS43LR16200D-6BLI-) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
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DISTI #
870-43LR16200D6BLITR
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Mouser Electronics | DRAM 32M, 1.8V, Mobile DDR, 2Mx16, 166Mhz, 60 ball BGA (8mmx10mm) RoHS, IT, T&R RoHS: Compliant | 0 |
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$2.3700 | Order Now |
Part Details for IS43LR16200D-6BLI-TR
IS43LR16200D-6BLI-TR CAD Models
IS43LR16200D-6BLI-TR Part Data Attributes
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IS43LR16200D-6BLI-TR
Integrated Silicon Solution Inc
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Datasheet
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IS43LR16200D-6BLI-TR
Integrated Silicon Solution Inc
IC SDRAM 32MBIT 166MHZ 60BGA
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Factory Lead Time | 8 Weeks | |
| Access Mode | DUAL BANK PAGE BURST | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 10 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | DDR1 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |