Part Details for FM93CS66LM8X by Fairchild Semiconductor Corporation
Results Overview of FM93CS66LM8X by Fairchild Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
FM93CS66LM8X Information
FM93CS66LM8X by Fairchild Semiconductor Corporation is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for FM93CS66LM8X
FM93CS66LM8X CAD Models
FM93CS66LM8X Part Data Attributes
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FM93CS66LM8X
Fairchild Semiconductor Corporation
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Datasheet
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FM93CS66LM8X
Fairchild Semiconductor Corporation
EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOIC-8
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | SOIC | |
| Package Description | 0.150 INCH, PLASTIC, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 0.25 MHz | |
| Data Retention Time-Min | 40 | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e0 | |
| Length | 4.9 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256X16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Serial Bus Type | MICROWIRE | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.001 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 3.9 mm | |
| Write Cycle Time-Max (tWC) | 15 ms | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for FM93CS66LM8X
This table gives cross-reference parts and alternative options found for FM93CS66LM8X. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FM93CS66LM8X, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M93S66-WMN1T | STMicroelectronics | Check for Price | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | FM93CS66LM8X vs M93S66-WMN1T |
| M93S66-WMN1 | STMicroelectronics | Check for Price | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | FM93CS66LM8X vs M93S66-WMN1 |
FM93CS66LM8X Frequently Asked Questions (FAQ)
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Fairchild recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
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Fairchild recommends following the recommended operating conditions, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
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The maximum allowed voltage on the VCC pin during power-up or power-down is 4.5V. Exceeding this voltage may cause damage to the device.
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Fairchild recommends following standard ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD bag. Additionally, ensure that the device is stored in its original packaging or an ESD-protective container when not in use.
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Fairchild recommends a soldering temperature of 260°C (500°F) and a soldering time of 10 seconds or less to prevent damage to the device.