Part Details for FGA25N120ANTDTU by Rochester Electronics LLC
Results Overview of FGA25N120ANTDTU by Rochester Electronics LLC
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- Part Data Attributes: (Available)
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FGA25N120ANTDTU Information
FGA25N120ANTDTU by Rochester Electronics LLC is an IGBT.
IGBTs are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for FGA25N120ANTDTU
FGA25N120ANTDTU CAD Models
FGA25N120ANTDTU Part Data Attributes
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FGA25N120ANTDTU
Rochester Electronics LLC
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Datasheet
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FGA25N120ANTDTU
Rochester Electronics LLC
Insulated Gate Bipolar Transistor
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| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Package Description | TO-3PN, 3 PIN | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Collector Current-Max (IC) | 50 A | |
| Collector-Emitter Voltage-Max | 1200 V | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| Gate-Emitter Thr Voltage-Max | 7.5 V | |
| Gate-Emitter Voltage-Max | 20 V | |
| JESD-30 Code | R-PSFM-T3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 312 W | |
| Surface Mount | NO | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | SINGLE | |
| Transistor Application | POWER CONTROL | |
| Transistor Element Material | SILICON | |
| Turn-off Time-Nom (toff) | 290 ns | |
| Turn-on Time-Nom (ton) | 110 ns |
FGA25N120ANTDTU Frequently Asked Questions (FAQ)
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The thermal resistance of the FGA25N120ANTDTU is typically around 0.5°C/W (junction-to-case) and 1.5°C/W (junction-to-ambient) when mounted on a standard PCB with a copper heat sink.
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Yes, the FGA25N120ANTDTU is a high-reliability device, suitable for use in aerospace, defense, and other critical applications. Rochester Electronics LLC provides a range of screening and testing options to ensure the device meets the required standards.
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To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F). Also, ensure the PCB is designed with a suitable thermal pad and heat sink to dissipate heat efficiently.
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The recommended gate drive voltage for the FGA25N120ANTDTU is between 10V and 15V, with a maximum gate-source voltage of ±20V. However, it's essential to consult the datasheet and application notes for specific gate drive requirements.
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Yes, the FGA25N120ANTDTU can be used in a parallel configuration to increase current handling. However, it's crucial to ensure that the devices are properly matched, and the gate drive and thermal management are designed to handle the increased current and heat dissipation.