Part Details for F2270NLGK by Integrated Device Technology Inc
Results Overview of F2270NLGK by Integrated Device Technology Inc
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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F2270NLGK Information
F2270NLGK by Integrated Device Technology Inc is an RF/Microwave Attenuator.
RF/Microwave Attenuators are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Part Details for F2270NLGK
F2270NLGK CAD Models
F2270NLGK Part Data Attributes
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F2270NLGK
Integrated Device Technology Inc
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Datasheet
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F2270NLGK
Integrated Device Technology Inc
VFQFPN-16, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | VFQFPN | |
| Package Description | VFQFPN-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | NLG16P2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Attenuation-Nom | 35 dB | |
| Characteristic Impedance | 75 Ω | |
| Construction | COMPONENT | |
| Input Power-Max (CW) | 28 dBm | |
| Insertion Loss-Max | 1.8 dB | |
| JESD-609 Code | e3 | |
| Mounting Feature | SURFACE MOUNT | |
| Number of Terminals | 16 | |
| Operating Frequency-Max | 3000 MHz | |
| Operating Frequency-Min | 5 MHz | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | LCC16,.12SQ,20 | |
| Power Supplies | 5 V | |
| RF/Microwave Device Type | VARIABLE ATTENUATOR | |
| Supply Current-Max | 2.5 mA | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| VSWR-Max | 1.15 |
F2270NLGK Frequently Asked Questions (FAQ)
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A good PCB layout for the F2270NLGK involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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To ensure proper power-up and power-down of the F2270NLGK, follow a controlled power-up sequence, starting with the voltage supply, then the clock, and finally the data inputs. During power-down, reverse this sequence. Also, ensure that the power supply voltage is within the recommended range and that the device is not exposed to voltage spikes or dips.
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The F2270NLGK has a maximum junction temperature of 150°C. To manage thermal performance, use a heat sink or thermal pad, ensure good airflow, and avoid blocking the thermal pads on the package. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink or PCB.
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To troubleshoot issues with the F2270NLGK, start by verifying the power supply voltage, clock frequency, and data input signals. Use an oscilloscope to check for signal integrity and jitter. Also, review the PCB layout and ensure that it meets the recommended guidelines. If issues persist, consult the device's application notes and contact IDT support for further assistance.
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Yes, the F2270NLGK is a high-speed device and can be susceptible to EMI/EMC issues. To minimize these effects, use a shielded enclosure, keep the device away from noise sources, and use EMI filters or chokes on the input and output signals. Also, ensure that the PCB layout is designed to minimize radiation and coupling between signals.