Part Details for F1653NLGI by Integrated Device Technology Inc
Results Overview of F1653NLGI by Integrated Device Technology Inc
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- Part Data Attributes: (Available)
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F1653NLGI Information
F1653NLGI by Integrated Device Technology Inc is an RF/Microwave Modulator/Demodulator.
RF/Microwave Modulator/Demodulators are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Part Details for F1653NLGI
F1653NLGI CAD Models
F1653NLGI Part Data Attributes
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F1653NLGI
Integrated Device Technology Inc
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Datasheet
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F1653NLGI
Integrated Device Technology Inc
VFQFPN-24, Tray
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| Pbfree Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | VFQFPN | |
| Pin Count | 24 | |
| Manufacturer Package Code | NLG24P1 | |
| Reach Compliance Code | unknown | |
| RF/Microwave Device Type | MODULATOR |
F1653NLGI Frequently Asked Questions (FAQ)
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A good PCB layout for the F1653NLGI should consider signal integrity, power integrity, and thermal management. It's recommended to follow the guidelines provided in the IDT application note AN-827, which includes layout recommendations for the device.
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The F1653NLGI requires a 1.8V core voltage and 3.3V I/O voltage. Power sequencing is critical, and it's recommended to power up the 1.8V core voltage first, followed by the 3.3V I/O voltage. A soft-start power-up sequence is also recommended to prevent inrush currents.
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The F1653NLGI has a maximum junction temperature of 125°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal management guidelines provided in the IDT application note AN-827.
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To achieve optimal jitter performance, ensure that the device is properly terminated, and the input clock signal meets the recommended specifications. Additionally, adjust the device's internal PLL settings and clock distribution network to minimize jitter.
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To minimize EMI and RFI, follow proper PCB layout and shielding techniques, use a ground plane, and ensure that the device is properly decoupled. Additionally, consider using EMI filters or shielding components to reduce electromagnetic radiation.