Part Details for EP2AGX125DF25C4G by Intel Corporation
Results Overview of EP2AGX125DF25C4G by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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EP2AGX125DF25C4G Information
EP2AGX125DF25C4G by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for EP2AGX125DF25C4G
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 1394 |
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RFQ | ||
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Quest Components | 1115 |
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$3,251.5500 / $3,685.0900 | Buy Now |
Part Details for EP2AGX125DF25C4G
EP2AGX125DF25C4G CAD Models
EP2AGX125DF25C4G Part Data Attributes
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EP2AGX125DF25C4G
Intel Corporation
Buy Now
Datasheet
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EP2AGX125DF25C4G
Intel Corporation
Field Programmable Gate Array, 118143-Cell, PBGA572, FBGA-572
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-572 | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B572 | |
| Length | 25 mm | |
| Number of CLBs | 4964 | |
| Number of Inputs | 260 | |
| Number of Logic Cells | 118143 | |
| Number of Outputs | 260 | |
| Number of Terminals | 572 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 4964 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA572,24X24,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 2.15 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm |
EP2AGX125DF25C4G Frequently Asked Questions (FAQ)
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The maximum power consumption of EP2AGX125DF25C4G is around 25W, but it can vary depending on the specific use case and operating conditions.
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To implement DDR3 memory interface with EP2AGX125DF25C4G, you need to use the dedicated DDR3 memory controller and follow the guidelines provided in the Intel FPGA Memory Interface Handbook.
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Yes, EP2AGX125DF25C4G is suitable for high-speed data processing applications due to its high clock frequency (up to 500 MHz) and large number of logic elements (around 125,000).
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To optimize the performance of EP2AGX125DF25C4G, you need to use the Intel Quartus Prime software to synthesize, map, and place your design. You can also use various optimization techniques such as pipelining, parallel processing, and resource sharing.
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Yes, EP2AGX125DF25C4G is compatible with PCIe interface through its hardened PCIe endpoint block, which supports up to x8 lanes at Gen3 speeds.