Datasheets
DSP56303VF100 by:

24-BIT, 100 MHz, OTHER DSP, PBGA196, MOLDED ARRAY PROCESS, BGA-196

Part Details for DSP56303VF100 by Rochester Electronics LLC

Results Overview of DSP56303VF100 by Rochester Electronics LLC

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DSP56303VF100 Information

DSP56303VF100 by Rochester Electronics LLC is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for DSP56303VF100

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DSP56303VF100 Part Data Attributes

DSP56303VF100 Rochester Electronics LLC
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DSP56303VF100 Rochester Electronics LLC 24-BIT, 100 MHz, OTHER DSP, PBGA196, MOLDED ARRAY PROCESS, BGA-196
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer ROCHESTER ELECTRONICS INC
Part Package Code BGA
Package Description LBGA,
Pin Count 196
Reach Compliance Code unknown
Address Bus Width 18
Barrel Shifter YES
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 24
Format FIXED POINT
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B196
JESD-609 Code e0
Length 15 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 196
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220
Qualification Status COMMERCIAL
Seated Height-Max 1.6 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

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