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Part Details for DS36276M by Texas Instruments
Results Overview of DS36276M by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
DS36276M Information
DS36276M by Texas Instruments is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for DS36276M
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 1602 |
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RFQ |
Part Details for DS36276M
DS36276M CAD Models
DS36276M Part Data Attributes
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DS36276M
Texas Instruments
Buy Now
Datasheet
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DS36276M
Texas Instruments
FailSafe Multipoint Transceiver 8-SOIC 0 to 70
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | SOIC | |
| Package Description | PLASTIC, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Additional Feature | COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER | |
| Differential Output | YES | |
| Driver Number of Bits | 1 | |
| High Level Input Current-Max | 0.00002 A | |
| Input Characteristics | DIFFERENTIAL SCHMITT TRIGGER | |
| Interface IC Type | LINE TRANSCEIVER | |
| Interface Standard | V.11; EIA-422-A; TIA-422-A; EIA-485; TIA-485 | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e0 | |
| Length | 4.9 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Out Swing-Min | 1.5 V | |
| Output Low Current-Max | 0.016 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | Not Qualified | |
| Receive Delay-Max | 70 ns | |
| Receiver Number of Bits | 1 | |
| Seated Height-Max | 1.75 mm | |
| Supply Current-Max | 60 mA | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Transmit Delay-Max | 60 ns | |
| Width | 3.9 mm |
Alternate Parts for DS36276M
This table gives cross-reference parts and alternative options found for DS36276M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DS36276M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| DS36276MX | National Semiconductor Corporation | Check for Price | IC LINE TRANSCEIVER, PDSO8, SOIC-8, Line Driver or Receiver | DS36276M vs DS36276MX |
| DS36276M/NOPB | National Semiconductor Corporation | Check for Price | IC LINE TRANSCEIVER, PDSO8, PLASTIC, SOIC-8, Line Driver or Receiver | DS36276M vs DS36276M/NOPB |
| DS36276M | National Semiconductor Corporation | Check for Price | IC LINE TRANSCEIVER, PDSO8, PLASTIC, SOIC-8, Line Driver or Receiver | DS36276M vs DS36276M |
DS36276M Frequently Asked Questions (FAQ)
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Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as separating analog and digital grounds, using a solid ground plane, and minimizing trace lengths and loops. Additionally, placing decoupling capacitors close to the device and using a low-ESR capacitor for the VCC pin can help reduce noise and ensure reliable operation.
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The DS36276M is a highly configurable device, and the optimal configuration depends on the specific application requirements. Engineers should consult the datasheet and application notes to determine the best settings for their use case. Additionally, Texas Instruments provides a Clock and Data Rate Calculator tool to help with configuration. It's also recommended to consult with TI's support team or a qualified engineer with experience in similar applications.
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The DS36276M has a maximum junction temperature of 150°C, and engineers should ensure that the device operates within the recommended temperature range. Thermal management techniques, such as heat sinks, thermal vias, and thermal interface materials, can help reduce the device's temperature. Additionally, engineers should consider the thermal resistance of the PCB and the surrounding environment to ensure reliable operation in high-temperature environments.
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To troubleshoot issues with the DS36276M, engineers should follow a systematic approach, starting with a review of the device's configuration and setup. They should then use tools like oscilloscopes and logic analyzers to analyze the clock and data signals. Texas Instruments also provides a troubleshooting guide in the datasheet and application notes, which can help identify and resolve common issues. Additionally, engineers can consult with TI's support team or online forums for further assistance.
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The DS36276M is designed to meet various EMI and RFI regulations, such as CISPR 22 and FCC Part 15. Engineers should follow good design practices, such as using shielding, filtering, and grounding techniques, to minimize electromagnetic interference. They should also consult the datasheet and application notes for specific guidance on EMI and RFI considerations. Additionally, engineers may need to perform EMI and RFI testing to ensure compliance with relevant regulations and standards.