Part Details for DF2S23P2CTC,L3F(T by Toshiba America Electronic Components
Results Overview of DF2S23P2CTC,L3F(T by Toshiba America Electronic Components
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
DF2S23P2CTC,L3F(T Information
DF2S23P2CTC,L3F(T by Toshiba America Electronic Components is a Transient Suppressor.
Transient Suppressors are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for DF2S23P2CTC,L3F(T
DF2S23P2CTC,L3F(T CAD Models
DF2S23P2CTC,L3F(T Part Data Attributes
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DF2S23P2CTC,L3F(T
Toshiba America Electronic Components
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Datasheet
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DF2S23P2CTC,L3F(T
Toshiba America Electronic Components
Trans Voltage Suppressor Diode
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.50 | |
| Diode Type | TRANS VOLTAGE SUPPRESSOR DIODE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
DF2S23P2CTC,L3F(T Frequently Asked Questions (FAQ)
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Toshiba recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the power traces. Additionally, a thermal pad on the bottom of the package should be connected to a heat sink or a thermal interface material.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots.
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Toshiba recommends a peak reflow temperature of 260°C (500°F) with a dwell time of 30 seconds to 1 minute. The recommended soldering process is a reflow soldering process with a nitrogen atmosphere. It's essential to follow the recommended soldering conditions to prevent damage to the device.
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To prevent ESD damage, it's essential to handle the device in an ESD-controlled environment. Use ESD-safe materials, such as wrist straps, mats, and bags, to prevent static electricity buildup. Additionally, ensure that all equipment and tools are properly grounded.
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Toshiba recommends storing the device in a dry, cool place with a temperature range of -10°C to 30°C (14°F to 86°F) and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures. It's also essential to handle the device by the body, rather than the leads, to prevent damage.