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Part Details for DF2218UTF24V by Renesas Electronics Corporation
Results Overview of DF2218UTF24V by Renesas Electronics Corporation
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
DF2218UTF24V Information
DF2218UTF24V by Renesas Electronics Corporation is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DF2218UTF24V
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
DF2218UTF24V-ND
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DigiKey | IC MCU 16BIT 128KB FLASH 100TQFP Min Qty: 100 Lead time: 12 Weeks Container: Tray |
100 In Stock |
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$22.4228 | Buy Now |
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DISTI #
85983511
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Verical | MCU 16-bit H8S/2000 CISC 128KB Flash 2.5V/3.3V 100-Pin TQFP Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 Date Code: 2201 | Americas - 6049 |
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$25.5000 | Buy Now |
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DISTI #
85982720
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Verical | MCU 16-bit H8S/2000 CISC 128KB Flash 2.5V/3.3V 100-Pin TQFP Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 Date Code: 2301 | Americas - 84 |
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$25.5000 | Buy Now |
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Rochester Electronics | H8S/2218 - Microcontrollers for Mobile Device Applications RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 6133 |
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$16.3200 / $20.4000 | Buy Now |
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DISTI #
DF2218UTF24V
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Avnet Asia | MCU 16-bit/32-bit H8S CISC 128KB Flash 2.5V/3.3V 100-Pin TQFP (Alt: DF2218UTF24V) RoHS: Compliant Min Qty: 100 Package Multiple: 50 | 100 |
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RFQ | |
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DISTI #
DF2218UTF24V
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Avnet Silica | MCU 16bit32bit H8S CISC 128KB Flash 25V33V 100Pin TQFP (Alt: DF2218UTF24V) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for DF2218UTF24V
DF2218UTF24V CAD Models
DF2218UTF24V Part Data Attributes
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DF2218UTF24V
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
DF2218UTF24V
Renesas Electronics Corporation
Microcontrollers for Mobile Device Applications (Non Promotion), TFQFP, /Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TFQFP | |
| Package Description | 12 X 12 MM, 1.20 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, TQFP-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | PTQP0100LC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Has ADC | YES | |
| Additional Feature | ALSO OPERATES AT 2.4V MINIMUM SUPPLY | |
| Address Bus Width | 24 | |
| Bit Size | 16 | |
| Clock Frequency-Max | 24 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| Length | 12 mm | |
| Number of I/O Lines | 69 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 24 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
DF2218UTF24V Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
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Implement a heat sink or thermal pad on the top of the IC, and ensure good airflow. Consider using a thermal interface material (TIM) for improved heat transfer.
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A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, placed as close to the VIN pin as possible.
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Use a high-precision external resistor divider network, and consider adding a 10nF to 100nF capacitor in parallel with the output voltage feedback resistor.
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The maximum allowed voltage on the EN pin is 6V. Ensure the EN pin is driven high after the input voltage (VIN) has reached a minimum of 2.5V, and the output voltage (VOUT) has stabilized.