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Rectifier Diode,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
D4F60-5063 by Shindengen Electronic Manufacturing Co Ltd is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
627-D4F60-5063
|
Mouser Electronics | Small Signal Switching Diodes 4.0 Amp 600 Volt RoHS: Compliant | 0 |
|
$0.6750 / $1.6000 | Order Now |
|
Quest Components | RECTIFIER DIODE | 27342 |
|
$0.5460 / $1.3000 | Buy Now |
|
Quest Components | RECTIFIER DIODE | 8400 |
|
$0.4204 / $1.9110 | Buy Now |
|
Quest Components | RECTIFIER DIODE | 3798 |
|
$0.4725 / $1.5750 | Buy Now |
DISTI #
D4F60-5063
|
TME | Diode: rectifying, SMD, 600V, 4A, 2F, Ufmax: 0.95V, Ifsm: 200A Min Qty: 1 | 1499 |
|
$0.2590 / $3.9800 | Buy Now |
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D4F60-5063
Shindengen Electronic Manufacturing Co Ltd
Buy Now
Datasheet
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Compare Parts:
D4F60-5063
Shindengen Electronic Manufacturing Co Ltd
Rectifier Diode,
|
Part Life Cycle Code | Active | |
Ihs Manufacturer | SHINDENGEN ELECTRIC MANUFACTURING CO LTD | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Samacsys Manufacturer | Shindengen Electric Manufacturing Co., Ltd. | |
Additional Feature | HIGH RELIABILITY | |
Application | GENERAL PURPOSE | |
Configuration | SINGLE | |
Diode Element Material | SILICON | |
Diode Type | RECTIFIER DIODE | |
Forward Voltage-Max (VF) | 0.95 V | |
JESD-30 Code | R-PDSO-C2 | |
Non-rep Pk Forward Current-Max | 200 A | |
Number of Elements | 1 | |
Number of Phases | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 150 °C | |
Output Current-Max | 4 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Rep Pk Reverse Voltage-Max | 600 V | |
Reverse Current-Max | 10 µA | |
Reverse Test Voltage | 600 V | |
Surface Mount | YES | |
Terminal Form | C BEND | |
Terminal Position | DUAL |
The recommended PCB layout involves keeping the high-current paths short and wide, using multiple vias for heat dissipation, and placing the device on a thermal pad. Ensure good airflow and consider using a heat sink for high-power applications.
Implement proper thermal management, ensure good airflow, and consider derating the device's power handling at high temperatures. Regularly inspect the device for signs of wear and tear, and follow the manufacturer's recommended storage and handling procedures.
Handle the device in an ESD-protected environment, use wrist straps or mats, and store the device in anti-static packaging. Avoid touching the device's pins or leads, and use ESD-protected tools and equipment during assembly and testing.
Yes, but ensure that the devices are matched in terms of electrical characteristics, and implement a proper current sharing mechanism to prevent uneven current distribution. Consult the manufacturer's application notes for specific guidance.
Follow the manufacturer's recommended soldering profile, use a soldering iron with a temperature range of 350°C to 380°C, and avoid applying excessive force or pressure during rework. Use a solder with a melting point above 217°C to ensure reliable joints.