Part Details for BUK9832-55A/CUX by NXP Semiconductors
Results Overview of BUK9832-55A/CUX by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Energy and Power Systems
Electronic Manufacturing
Renewable Energy
BUK9832-55A/CUX Information
BUK9832-55A/CUX by NXP Semiconductors is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BUK9832-55A/CUX
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Quest Components | POWER FIELD-EFFECT TRANSISTOR, 12A I(D), 50V, 0.036OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET | 232 |
|
$0.5040 / $1.0800 | Buy Now |
|
|
Quest Components | POWER FIELD-EFFECT TRANSISTOR, 12A I(D), 50V, 0.036OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET | 135 |
|
$0.9000 / $1.8000 | Buy Now |
|
|
Quest Components | POWER FIELD-EFFECT TRANSISTOR, 12A I(D), 50V, 0.036OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET | 118 |
|
$0.3850 / $0.7700 | Buy Now |
|
|
NexGen Digital | 2 |
|
RFQ | ||
|
|
Win Source Electronics | MOSFET N-CH 55V 12A SOT223 | 14042 |
|
$0.3419 / $0.4412 | Buy Now |
Part Details for BUK9832-55A/CUX
BUK9832-55A/CUX CAD Models
BUK9832-55A/CUX Part Data Attributes
|
|
BUK9832-55A/CUX
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
BUK9832-55A/CUX
NXP Semiconductors
N-channel TrenchMOS logic level FET SC-73 4-Pin
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SC-73 | |
| Package Description | ROHS COMPLIANT, PLASTIC, SC-73, 4 PIN | |
| Pin Count | 4 | |
| Manufacturer Package Code | SOT223 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Avalanche Energy Rating (Eas) | 100 mJ | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 55 V | |
| Drain Current-Max (ID) | 12 A | |
| Drain-source On Resistance-Max | 0.036 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-G4 | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Mode | ENHANCEMENT MODE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | N-CHANNEL | |
| Pulsed Drain Current-Max (IDM) | 47 A | |
| Reference Standard | AEC-Q101; IEC-60134 | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
BUK9832-55A/CUX Frequently Asked Questions (FAQ)
-
A good PCB layout for the BUK9832-55A/CUX should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB.
-
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including a proper heat sink design, and to ensure that the device is operated within its specified temperature range.
-
When selecting a heat sink for the BUK9832-55A/CUX, critical parameters to consider include the thermal resistance, material, and size of the heat sink, as well as the thermal interface material (TIM) used to connect the device to the heat sink.
-
To protect the BUK9832-55A/CUX from EOS and ESD, it's essential to follow proper handling and assembly procedures, including the use of ESD-safe materials and equipment, and to ensure that the device is properly connected to a ground plane.
-
The recommended soldering conditions for the BUK9832-55A/CUX include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/second.