-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for BR24G02FJ-3GTE2 by ROHM Semiconductor
Results Overview of BR24G02FJ-3GTE2 by ROHM Semiconductor
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
BR24G02FJ-3GTE2 Information
BR24G02FJ-3GTE2 by ROHM Semiconductor is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for BR24G02FJ-3GTE2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
BR24G02FJ-3GTE2CT-ND
|
DigiKey | IC EEPROM 2KBIT I2C 400KHZ 8SOPJ Min Qty: 1 Lead time: 16 Weeks Container: Digi-Reel®, Tape & Reel (TR), Cut Tape (CT) |
1525 In Stock |
|
$0.1731 / $0.2300 | Buy Now |
|
DISTI #
BR24G02FJ-3GTE2
|
Avnet Americas | EEPROM Serial-I2C 2K-bit 256 x 8 2.5V/3V 8-Pin SOP-J Embossed T/R - Tape and Reel (Alt: BR24G02FJ-3GTE2) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 16 Weeks, 0 Days Container: Reel | 5000 |
|
$0.1315 | Buy Now |
|
DISTI #
755-BR24G02FJ-3GTE2
|
Mouser Electronics | EEPROM I2C BUS(2-Wre) 2K SOP-J8 EEPROM RoHS: Compliant | 2167 |
|
$0.1490 / $0.2300 | Buy Now |
|
DISTI #
66385532
|
Verical | EEPROM Serial-2Wire 2K-bit 256 x 8 1.8V/2.5V/3.3V/5V 8-Pin SOP-J T/R RoHS: Compliant Min Qty: 213 Package Multiple: 1 Date Code: 2233 | Americas - 1605 |
|
$0.1860 / $0.2110 | Buy Now |
|
DISTI #
60315498
|
Verical | EEPROM Serial-2Wire 2K-bit 256 x 8 1.8V/2.5V/3.3V/5V 8-Pin SOP-J T/R RoHS: Compliant Min Qty: 115 Package Multiple: 1 Date Code: 2101 | Americas - 115 |
|
$0.7103 | Buy Now |
|
DISTI #
86988295
|
Verical | EEPROM Serial-2Wire 2K-bit 256 x 8 1.8V/2.5V/3.3V/5V 8-Pin SOP-J T/R RoHS: Compliant Min Qty: 108 Package Multiple: 1 Date Code: 1801 | Americas - 108 |
|
$0.7561 | Buy Now |
|
DISTI #
SMC-BR24G02FJ-3GTE2
|
Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 39908 |
|
RFQ | |
|
DISTI #
BR24G02FJ-3GTE2
|
Avnet Asia | EEPROM Serial-I2C 2K-bit 256 x 8 2.5V/3V 8-Pin SOP-J Embossed T/R (Alt: BR24G02FJ-3GTE2) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 24 Weeks, 0 Days | 12500 |
|
$0.1688 / $0.1901 | Buy Now |
|
DISTI #
BR24G02FJ-3GTE2
|
Chip One Stop | Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 5 Lead time: 0 Weeks, 1 Days Container: Cut Tape | 1605 |
|
$0.1470 / $0.2110 | Buy Now |
Part Details for BR24G02FJ-3GTE2
BR24G02FJ-3GTE2 CAD Models
BR24G02FJ-3GTE2 Part Data Attributes
|
|
BR24G02FJ-3GTE2
ROHM Semiconductor
Buy Now
Datasheet
|
Compare Parts:
BR24G02FJ-3GTE2
ROHM Semiconductor
EEPROM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROHM CO LTD | |
| Package Description | SOP-8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | ROHM Semiconductor | |
| Additional Feature | SEATED HT-CALCULATED | |
| Clock Frequency-Max (fCLK) | 0.4 MHz | |
| Data Retention Time-Min | 40 | |
| Endurance | 1000000 Write/Erase Cycles | |
| I2C Control Byte | 1010DDDR | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e2 | |
| Length | 4.9 mm | |
| Memory Density | 2048 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LSOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, LOW PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 2.5 V | |
| Seated Height-Max | 1.65 mm | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000002 A | |
| Supply Current-Max | 0.002 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.6 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Copper (Sn/Cu) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 3.9 mm | |
| Write Cycle Time-Max (tWC) | 5 ms | |
| Write Protection | HARDWARE |
BR24G02FJ-3GTE2 Frequently Asked Questions (FAQ)
-
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 0.1uF decoupling capacitor near the VCC pin.
-
Use a reliable clock source, ensure proper signal termination, and implement error detection and correction mechanisms. Also, follow the recommended communication protocol and timing diagrams.
-
The device has a maximum junction temperature of 125°C. Ensure good airflow, use a heat sink if necessary, and avoid overheating during reflow soldering. Follow the recommended thermal design guidelines.
-
Yes, but ensure the device is properly secured to the PCB using a suitable mounting method. Follow the recommended PCB design and assembly guidelines to minimize the risk of mechanical stress.
-
Use ESD protection devices, such as TVS diodes, on the I/O lines. Follow proper handling and storage procedures to prevent ESD damage. Implement ESD protection in the PCB design and assembly process.