Part Details for BGU6102,147 by NXP Semiconductors
Results Overview of BGU6102,147 by NXP Semiconductors
- Distributor Offerings: (12 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BGU6102,147 Information
BGU6102,147 by NXP Semiconductors is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for BGU6102,147
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
60AC7946
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Newark | Rf Amplifier, 40Mhz, Hxson-6, Frequency Min:4Ghz, Frequency Max:40Mhz, Gain:18.5Db, Noise Figure Typ:1Db, Rf Ic Case Style:Hxson, No. Of Pins:6Pins, Supply Voltage Min:1.5V, Supply Voltage Max:5V, Operating Temperature Min:-, Rohs Compliant: Yes |Nxp BGU6102,147 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 0 |
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$0.7550 / $1.1700 | Buy Now |
DISTI #
90T4138
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Newark | Wideband Silicon Low-Noise Amplifier Mmic/ Reel Rohs Compliant: Yes |Nxp BGU6102,147 RoHS: Compliant Min Qty: 5000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$0.5340 / $0.6940 | Buy Now |
DISTI #
568-10150-1-ND
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DigiKey | IC RF AMP GPS 40MHZ-4GHZ 6HXSON Min Qty: 1 Lead time: 99 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
1567 In Stock |
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$0.6619 / $1.1900 | Buy Now |
DISTI #
BGU6102,147
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Avnet Americas | Low-Noise Amplifier (LNA) MMIC, 40 MHz to 4 GHz, 6 Pins, HXSON - Tape and Reel (Alt: BGU6102,147) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 111 Weeks, 0 Days Container: Reel | 0 |
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$0.4960 / $0.5129 | Buy Now |
DISTI #
771-BGU6102147
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Mouser Electronics | RF Amplifier LNA MMIC 4GHz 2.3dB RoHS: Compliant | 10188 |
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$0.5450 / $1.1900 | Buy Now |
DISTI #
V72:2272_06518486
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Arrow Electronics | RF Amp Single LNA 4GHz 5V 6-Pin HXSON EP T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 99 Weeks Date Code: 1635 Container: Cut Strips | Americas - 400 |
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$0.7708 / $0.7843 | Buy Now |
DISTI #
69060140
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Verical | RF Amp Single LNA 4GHz 5V 6-Pin HXSON EP T/R RoHS: Compliant Min Qty: 72 Package Multiple: 1 Date Code: 2301 | Americas - 2900 |
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$0.8040 / $0.9140 | Buy Now |
DISTI #
59282345
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Verical | RF Amp Single LNA 4GHz 5V 6-Pin HXSON EP T/R RoHS: Compliant Min Qty: 11 Package Multiple: 1 Date Code: 1635 | Americas - 400 |
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$0.9393 / $0.9494 | Buy Now |
DISTI #
BGU6102-147
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Richardson RFPD | RF & MW LNA RoHS: Compliant Min Qty: 5000 | 0 |
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$0.6300 | Buy Now |
DISTI #
BGU6102,147
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Avnet Silica | LowNoise Amplifier LNA MMIC 40 MHz to 4 GHz 6 Pins HXSON (Alt: BGU6102,147) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 54 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for BGU6102,147
BGU6102,147 CAD Models
BGU6102,147 Part Data Attributes
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BGU6102,147
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
BGU6102,147
NXP Semiconductors
BGU6102 - Wideband silicon low-noise amplifier MMIC
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Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Pin Count | SON | |
Manufacturer Package Code | SOT1209 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 111 Weeks | |
Samacsys Manufacturer | NXP | |
JESD-609 Code | e3 | |
Mounting Feature | SURFACE MOUNT | |
Number of Functions | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Equivalence Code | SOLCC6,.08,20 | |
Power Supplies | 3 V | |
RF/Microwave Device Type | WIDE BAND LOW POWER | |
Supply Current-Max | 21 mA | |
Surface Mount | YES | |
Terminal Finish | Tin (Sn) |
BGU6102,147 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching.
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Use a heat sink or thermal pad on the exposed pad of the IC. Ensure good airflow and keep the ambient temperature below 85°C.
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The maximum input power is +10 dBm. Exceeding this may cause damage to the device.
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Adjust the bias voltage (VCC) and current (ICC) according to the application's requirements. Typical values are VCC = 3.3V and ICC = 10mA.
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Use a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection IC to prevent damage from electrostatic discharge.