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Part Details for BGA8V1BN6E6327XTSA1 by Infineon Technologies AG
Results Overview of BGA8V1BN6E6327XTSA1 by Infineon Technologies AG
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BGA8V1BN6E6327XTSA1 Information
BGA8V1BN6E6327XTSA1 by Infineon Technologies AG is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for BGA8V1BN6E6327XTSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
93AC6969
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Newark | Rf Amplifier, 3.8Ghz, -40 To 85Deg C, Frequency Min:3.3Ghz, Frequency Max:3.8Ghz, Gain:15Db, Noise Figure Typ:1.2Db, Rf Ic Case Style:Tsnp, No. Of Pins:6Pins, Supply Voltage Min:1.6V, Supply Voltage Max:3.1V, Operating Temperature Rohs Compliant: Yes |Infineon BGA8V1BN6E6327XTSA1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 0 |
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$0.3870 / $0.6400 | Buy Now |
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DISTI #
2156-BGA8V1BN6E6327XTSA1-ND
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DigiKey | IC RF AMP 3.4GHZ-3.8GHZ TSNP6 Min Qty: 1 Lead time: 8 Weeks Container: Bulk MARKETPLACE PRODUCT |
22500 In Stock |
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$0.4100 | Buy Now |
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DISTI #
BGA8V1BN6E6327XTSA1CT-ND
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DigiKey | IC RF AMP 3.4GHZ-3.8GHZ TSNP6 Min Qty: 1 Lead time: 8 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) | Temporarily Out of Stock |
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$0.3074 / $0.7200 | Buy Now |
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DISTI #
BGA8V1BN6E6327XTSA
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Avnet Americas | Low-Noise Amplifier (LNA), 3.3 GHz to 3.8 GHz, 6 Pins, TSNP - Tape and Reel (Alt: BGA8V1BN6E6327XTSA) RoHS: Compliant Min Qty: 15000 Package Multiple: 15000 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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$0.2791 / $0.2849 | Buy Now |
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DISTI #
726-BGA8V1BN6E6327XT
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Mouser Electronics | RF Amplifier RF SILICON MMIC RoHS: Compliant | 6522 |
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$0.3010 / $1.6000 | Buy Now |
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DISTI #
85967504
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Verical | RF Amp Single LNA 3.8GHz 3.1V 6-Pin TSNP T/R RoHS: Compliant Min Qty: 849 Package Multiple: 1 Date Code: 1801 | Americas - 832500 |
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$0.3045 / $0.4420 | Buy Now |
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DISTI #
85971509
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Verical | RF Amp Single LNA 3.8GHz 3.1V 6-Pin TSNP T/R RoHS: Compliant Min Qty: 849 Package Multiple: 1 Date Code: 1701 | Americas - 405000 |
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$0.3045 / $0.4420 | Buy Now |
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DISTI #
85967494
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Verical | RF Amp Single LNA 3.8GHz 3.1V 6-Pin TSNP T/R RoHS: Compliant Min Qty: 849 Package Multiple: 1 Date Code: 1601 | Americas - 285000 |
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$0.3045 / $0.4420 | Buy Now |
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DISTI #
85970422
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Verical | RF Amp Single LNA 3.8GHz 3.1V 6-Pin TSNP T/R RoHS: Compliant Min Qty: 849 Package Multiple: 1 Date Code: 2101 | Americas - 40500 |
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$0.3045 / $0.4420 | Buy Now |
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Rochester Electronics | LTE / 3G LNAs RoHS: Compliant Status: Active Min Qty: 1 | 1563000 |
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$0.2436 / $0.3929 | Buy Now |
Part Details for BGA8V1BN6E6327XTSA1
BGA8V1BN6E6327XTSA1 CAD Models
BGA8V1BN6E6327XTSA1 Part Data Attributes
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BGA8V1BN6E6327XTSA1
Infineon Technologies AG
Buy Now
Datasheet
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BGA8V1BN6E6327XTSA1
Infineon Technologies AG
Telecom Circuit,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | TSNP-6 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | R-PDSO-N6 | |
| Length | 1.1 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
| Seated Height-Max | 0.4 mm | |
| Supply Voltage-Nom | 2.8 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | DUAL | |
| Width | 0.7 mm |
BGA8V1BN6E6327XTSA1 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout and land pattern in their application note AN2013-01, which can be found on their website. It's essential to follow these guidelines to ensure reliable assembly and operation.
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The device has a thermal pad on the bottom, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. Additionally, consider using thermal vias, heat sinks, or other cooling solutions depending on the application's thermal requirements.
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Infineon recommends following the JEDEC J-STD-020D.1 standard for soldering and rework of the BGA8V1BN6E6327XTSA1. This standard provides guidelines for temperature profiles, soldering times, and other critical parameters to ensure reliable assembly.
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Infineon provides a range of tools and resources, including datasheets, application notes, and development boards, to help troubleshoot and debug issues. Additionally, consider using oscilloscopes, logic analyzers, or other debugging tools to identify and resolve problems.
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The device is rated for operation in the -40°C to 125°C temperature range, with a maximum junction temperature of 150°C. It's essential to ensure that the operating conditions, including voltage, current, and environmental factors, are within the specified limits to guarantee reliable operation.