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Part Details for BGA7H1BN6E6327XTSA1 by Infineon Technologies AG
Results Overview of BGA7H1BN6E6327XTSA1 by Infineon Technologies AG
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BGA7H1BN6E6327XTSA1 Information
BGA7H1BN6E6327XTSA1 by Infineon Technologies AG is a Cellular Telephone Circuit.
Cellular Telephone Circuits are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for BGA7H1BN6E6327XTSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
58AJ1678
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Newark | Rf Amplifiers, -40 To 85Deg C, Tsnp-6 Rohs Compliant: Yes |Infineon BGA7H1BN6E6327XTSA1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 1360 |
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$0.2920 / $0.6100 | Buy Now |
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DISTI #
448-BGA7H1BN6E6327XTSA1CT-ND
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DigiKey | IC AMP LTE 1.805-2.69GHZ TSNP6 Min Qty: 1 Lead time: 8 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
14920 In Stock |
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$0.2544 / $0.6100 | Buy Now |
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DISTI #
BGA7H1BN6E6327XTSA
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Avnet Americas | Low-Noise Amplifier (LNA), 1.805 GHz to 2.69 GHz, 6 Pins, TSNP - Tape and Reel (Alt: BGA7H1BN6E6327XTSA) RoHS: Compliant Min Qty: 15000 Package Multiple: 15000 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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$0.2661 | Buy Now |
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DISTI #
726-BGA7H1BN6E6327XT
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Mouser Electronics | RF Amplifier RF MMIC SUB 3 GHZ RoHS: Compliant | 5331 |
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$0.2510 / $0.6100 | Buy Now |
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DISTI #
85970099
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Verical | RF Amp Single LNA 2.69GHz 3.6V 6-Pin TSNP T/R RoHS: Compliant Min Qty: 1115 Package Multiple: 1 Date Code: 2101 | Americas - 2850000 |
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$0.2513 / $0.3364 | Buy Now |
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DISTI #
85970705
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Verical | RF Amp Single LNA 2.69GHz 3.6V 6-Pin TSNP T/R RoHS: Compliant Min Qty: 1115 Package Multiple: 1 Date Code: 1901 | Americas - 13330 |
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$0.2513 / $0.3364 | Buy Now |
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DISTI #
85970716
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Verical | RF Amp Single LNA 2.69GHz 3.6V 6-Pin TSNP T/R RoHS: Compliant Min Qty: 1115 Package Multiple: 1 Date Code: 2001 | Americas - 6180 |
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$0.2513 / $0.3364 | Buy Now |
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Rochester Electronics | Silicon Germanium Low Noise Amplifier for LTE RoHS: Compliant Status: Active Min Qty: 1 | 2869510 |
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$0.2010 / $0.3242 | Buy Now |
Part Details for BGA7H1BN6E6327XTSA1
BGA7H1BN6E6327XTSA1 CAD Models
BGA7H1BN6E6327XTSA1 Part Data Attributes
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BGA7H1BN6E6327XTSA1
Infineon Technologies AG
Buy Now
Datasheet
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BGA7H1BN6E6327XTSA1
Infineon Technologies AG
RF and Baseband Circuit, PBCC6, TSNP-6
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | TSNP-6 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | R-PBCC-N6 | |
| JESD-609 Code | e3 | |
| Length | 1.1 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VQCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, VERY THIN PROFILE | |
| Seated Height-Max | 0.4 mm | |
| Supply Voltage-Nom | 2.8 V | |
| Surface Mount | YES | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Width | 0.7 mm |
BGA7H1BN6E6327XTSA1 Frequently Asked Questions (FAQ)
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Infineon provides a reference design guide for PCB layout and thermal management, which includes recommendations for copper thickness, thermal vias, and heat sink design. It's essential to follow these guidelines to ensure optimal performance and reliability.
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To ensure signal integrity and minimize EMI, it's crucial to follow proper PCB design practices, such as using differential pairs, minimizing trace lengths, and using shielding and grounding techniques. Additionally, Infineon provides guidelines for signal integrity and EMI mitigation in their application notes.
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The recommended power supply and decoupling capacitor values can be found in the datasheet, but it's essential to consider the specific application requirements and PCB layout when selecting the capacitor values. Infineon also provides guidelines for power supply and decoupling capacitor selection in their application notes.
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Infineon provides a secure boot process implementation guide, which includes recommendations for secure boot mechanisms, such as cryptographic algorithms and secure key storage. It's essential to follow these guidelines to ensure the security and integrity of the device.
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The thermal limitations and derating factors can be found in the datasheet, but it's essential to consider the specific application requirements and operating conditions when selecting the device. Infineon also provides thermal simulation models and guidelines for thermal management in their application notes.